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AD8691 Datasheet(PDF) 11 Page - Analog Devices

Part No. AD8691
Description  Low Cost, Low Noise, CMOS Rail-to-Rail Output Operational Amplifiers
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Maker  AD [Analog Devices]
Homepage  http://www.analog.com
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AD8691 Datasheet(HTML) 11 Page - Analog Devices

 
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AD8691/AD8692/AD8694
Rev. 0 | Page 11 of 12
OUTLINE DIMENSIONS
0.80
0.60
0.40
4
8
1
5
4.90
BSC
PIN 1
0.65 BSC
3.00
BSC
SEATING
PLANE
0.15
0.00
0.38
0.22
1.10 MAX
3.00
BSC
COPLANARITY
0.10
0.23
0.08
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 34. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-203AA
0.30
0.15
0.10 MAX
1.00
0.90
0.70
SEATING
PLANE
0.22
0.08
1.10
0.80
0.30
0.10
4
5
12
3
PIN 1
0.65 BSC
2.20
2.00
1.80
2.40
2.10
1.80
1.35
1.25
1.15
0.10 COPLANARITY
0.40
0.10
Figure 35. 5-Lead Thin Shrink Small Outline Package [SC70]
(KS-5)
Dimensions shown in millimeters
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
× 45°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
85
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2440)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012-AA
Figure 36. 8-Lead Standard Small Outline Package [SOIC]
Narrow Body (R-8)
Dimensions shown in millimeters and (inches)
*COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH
THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS.
PIN 1
1.60 BSC
2.80 BSC
1.90
BSC
0.95 BSC
0.20
0.08
0.60
0.45
0.30
0.50
0.30
0.10 MAX
SEATING
PLANE
*1.00 MAX
*0.90
0.87
0.84
2.90 BSC
54
12
3
Figure 37. 5-Lead Thin Small Outline Transistor Package [TSOT]
(UJ-5)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012-AB
COPLANARITY
0.10
14
8
7
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
8.75 (0.3445)
8.55 (0.3366)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
× 45°
Figure 38. 14-Lead Standard Small Outline Package [SOIC]
Narrow Body (R-14)
Dimensions shown in millimeters
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65
BSC
SEATING
PLANE
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AB-1
Figure 39. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters


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