Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.COM

X  

Preview PDF Download HTML

GTL2007 Datasheet(PDF) 17 Page - NXP Semiconductors

Part No. GTL2007
Description  13-bit GTL to LVTTL translator with power good control
Download  19 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

GTL2007 Datasheet(HTML) 17 Page - NXP Semiconductors

Back Button GTL2007 Datasheet HTML 11Page - NXP Semiconductors GTL2007 Datasheet HTML 12Page - NXP Semiconductors GTL2007 Datasheet HTML 13Page - NXP Semiconductors GTL2007 Datasheet HTML 14Page - NXP Semiconductors GTL2007 Datasheet HTML 15Page - NXP Semiconductors GTL2007 Datasheet HTML 16Page - NXP Semiconductors GTL2007 Datasheet HTML 17Page - NXP Semiconductors GTL2007 Datasheet HTML 18Page - NXP Semiconductors GTL2007 Datasheet HTML 19Page - NXP Semiconductors  
Zoom Inzoom in Zoom Outzoom out
 17 / 19 page
background image
9397 750 13264
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2005
17 of 19
Philips Semiconductors
GTL2007
13-bit GTL to LVTTL translator with power good control
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
16. Abbreviations
17. Revision history
Table 15:
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal Oxide Silicon
CPU
Central Processing Unit
ESD
Electrostatic Discharge
GTL
Gunning Transceiver Logic
HBM
Human Body Model
LVTTL
Low Voltage Transistor-Transistor Logic
MM
Machine Model
PRR
Pulse Rate Repetition
TTL
Transistor-Transistor Logic
VRD
Voltage Regulator Down
Table 16:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
GTL2007_1
20050602
Product data sheet
-
9397 750 13264
-


Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19 


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn