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NUP4304MR6 Datasheet(PDF) 2 Page - ON Semiconductor |
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NUP4304MR6 Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 6 page ![]() NUP4304MR6 http://onsemi.com 2 THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance Junction−to−Ambient RqJA 556 °C/W Lead Solder Temperature Maximum 10 Seconds Duration TL 260 °C Junction Temperature TJ −40 to +85 °C Storage Temperature Tstg −55 to +150 °C ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) (Each Diode) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Reverse Breakdown Voltage (I(BR) = 100 mA) V(BR) 70 − − Vdc Reverse Voltage Leakage Current (VR = 70 Vdc) (VR = 25 Vdc, TJ = 150°C) (VR = 70 Vdc, TJ = 150°C) IR − − − − − − 2.5 30 50 mAdc Capacitance (between I/O pins) (VR = 0 V, f = 1.0 MHz) CD − 0.8 1.5 pF Capacitance (between I/O pin and ground) (VR = 0 V, f = 1.0 MHz) CD − 1.6 3 pF Forward Voltage (IF = 1.0 mAdc) (IF = 10 mAdc) (IF = 50 mAdc) (IF = 150 mAdc) VF − − − − − − − − 715 855 1000 1250 mVdc 1. FR−5 = 1.0 0.75 0.062 in. 2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. |