NUF8401MN

http://onsemi.com

4

PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION b APPLIES TO TERMINAL AND

IS MEASURED BETWEEN 0.25 AND 0.30 MM

FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.18

0.30

D

4.00 BSC

D2

3.10

3.30

E

1.60 BSC

E2

0.30

0.50

e

0.50 BSC

K

0.20

−−−

L

0.20

0.40

0.15 C

D

E

B

A

2X

2X

16X

A

A1

(A3)

0.15 C

PIN ONE

REFERENCE

0.08 C

0.10 C

C

SEATING

PLANE

D2

E2

BOTTOM VIEW

b

e

16X

0.10

B

0.05

A

C

C

L

16X

K

16X

SIDE VIEW

TOP VIEW

NOTE 3

18

9

16

2X

0.25 x 0.40 mm

TEST PAD SIZE

(A3)

DFN16

CASE 506AC−01

ISSUE B

0.50

4.10

0.50 PITCH

14X

mm

inches

SCALE 16:1

1.91

0.51

16X

0.28

16X

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

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NUF8401MN/D

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