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NUF8001MU Datasheet(PDF) 1 Page - ON Semiconductor

Part No. NUF8001MU
Description  Low Capacitance 8 Line EMI Filter with ESD Protection in UDFN Package
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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NUF8001MU Datasheet(HTML) 1 Page - ON Semiconductor

   
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© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 0
1
Publication Order Number:
NUF8001MU/D
NUF8001MU
Low Capacitance 8 Line EMI
Filter with ESD Protection in
UDFN Package
This device is an 8 line EMI filter array for wireless applications.
Greater than −25 dB attenuation is obtained at frequencies from 800 MHz
to 5.0 GHz. The NUF8001MU has a cut−off frequency of 160 MHz and
can be used in applications for data rate up to 60 MHz or 120 Mbps. This
UDFN package is specifically designed to enhance EMI filtering for
low−profile or slim design electronics especially where space and height
is a premium. It also offers ESD protection−clamping transients from
static discharges. ESD protection is provided across all capacitors.
Features
EMI Filtering and ESD Protection
Integration of 40 Discrete Components
Compliance with IEC61000−4−2 (Level 4): > 12 kV (Contact)
UDFN Package, 1.2 x 3.5 mm, 0.4 mm Pitch
Moisture Sensitivity Level 1
ESD Ratings: Machine Model = C
Human Body Model = 3B
This is a Pb−Free Device*
Benefits
Reduces EMI/RFI Emmisions on a Data Line
Low Profile Package; Typical Height of 0.5 mm
Design−Friendly and Easy−to−Use Pin Configurations,
Particularly for Portable Electronics
Integrated Solution Offers Cost and Space Savings in UDFN Package
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
Integrated Solution Improves System Reliability
Applications
EMI Filtering and ESD Protection for Data Lines
Keypad Interface and Protection for Portable Electronics
Bottom Connector Interface for Mobile Handsets
Notebook Computers and Digital Cameras
LCD Display Interface in Mobile Handsets
Camera Display Interface in Mobile Handsets
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device
Package
Shipping
ORDERING INFORMATION
NUF8001MUT2G
UDFN16
(Pb−Free)
3000 / Tape & Reel
MARKING
DIAGRAM
http://onsemi.com
(Top View)
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†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
801 = Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
http://onsemi.com
1
801
AYW
G
UDFN16
MU SUFFIX
CASE 517AF
1
16


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