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NUF4001MU Datasheet(PDF) 1 Page - ON Semiconductor

Part No. NUF4001MU
Description  Low Capacitance 4 Line EMI Filter with ESD Protection in UDFN8 Package
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NUF4001MU Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 1
1
Publication Order Number:
NUF4001MU/D
NUF4001MU
Low Capacitance
4 Line EMI Filter with
ESD Protection in UDFN8
Package
This device is a 4 line EMI filter array for wireless applications.
Greater than −25 dB attenuation is obtained at frequencies from
800 MHz to 5.0 GHz. The NUF4001MU has a cut−off frequency of
150 MHz and can be used in applications for data rate up to 58 MHz or
116 Mbps. This UDFN package is specifically designed to enhance
EMI filtering for low−profile or slim design electronics especially
where space and height is a premium. It also offers ESD
protection−clamping transients from static discharges. ESD protection
is provided across all capacitors.
Features
EMI Filtering and ESD Protection
Integration of 20 Discrete Components
Compliance with IEC61000−4−2 (Level 4)
>14 kV (Contact)
>15 kV (Air)
UDFN Package, 1.2 x 1.8 mm
Moisture Sensitivity Level 1
ESD Ratings: Machine Model = C
Human Body Model = 3B
This is a Pb−Free Device*
Benefits
Reduces EMI/RFI Emmisions on a Data Line
Low Profile Package; Typical Height of 0.5 mm
Design−Friendly and Easy−to−Use Pin Configurations,
Particularly for Portable Electronics
Integrated Solution Offers Cost and Space Savings in UDFN Package
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
Integrated Solution Improves System Reliability
Applications
EMI Filtering and ESD Protection for Data Lines
Keypad Interface and Protection for Portable Electronics
Bottom Connector Interface for Mobile Handsets
Notebook Computers and Digital Cameras
LCD Display Interface in Mobile Handsets
Camera Display Interface in Mobile Handsets
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
UDFN8
CASE 517AD
Device
Package
Shipping
ORDERING INFORMATION
NUF4001MUT2G
UDFN8
(Pb−Free)
3000 / Tape & Reel
MARKING
DIAGRAM
http://onsemi.com
1
41
= Specific Device Code
M
= Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
(Top View)
1
41 M
G
G
Cd
Cd
8
2
Cd
Cd
7
3
Cd
Cd
6
4
Cd
Cd
5
PIN CONNECTIONS
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1
8
14
5
8


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