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NUF3101FC Datasheet(PDF) 1 Page - ON Semiconductor

Part No. NUF3101FC
Description  Three Line EMI Filter
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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NUF3101FC Datasheet(HTML) 1 Page - ON Semiconductor

   
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© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 2
1
Publication Order Number:
NUF3101FC/D
NUF3101FC
Three Line EMI Filter
This device is a three−line EMI filter array for SIM Card wireless
applications. Greater than −25 dB attenuation is obtained at
frequencies from 800 MHz to 2.2 GHz. ESD protection is provided
across all capacitors.
Features
EMI Filtering and ESD Protection
Integration of 10 Discretes
Provides Protection for IEC61000−4−2 (Level 4)
8.0 kV (Contact)
15 kV (Air)
Flip−Chip Package
Moisture Sensitivity Level 1
ESD Rating: Machine Model = C; Human Body Model = 3B
Pb−Free Package is Available*
Benefits
Reduces EMI/RFI Emissions on a Data Line
Integrated Solution Offers Cost and Space Savings
Reduces Parasitic Inductances Which Offer a More “Ideal”
Low Pass Filter Response
Integrated Solution Improves System Reliability
Applications
SIM Card
EMI Filtering and ESD Protection for Data Lines
Cell Phones
Handheld Products
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
ESD Discharge
IEC61000−4−2
Air Discharge
VPP
15
kV
Contact Discharge
8.0
Steady−State Power per Resistor
PR
100
mW
Steady−State Power per Package
PT
300
mW
Operating Temperature Range
TOP
−40 to +85
°C
Storage Temperature Range
TSTG
−55 to +150
°C
Junction Temperature
TJ
+125
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device
Package
Shipping†
ORDERING INFORMATION
NUF3101FCT1
Flip−Chip
3000 Tape & Reel
MARKING
DIAGRAM
8−Pin Flip−Chip
FC SUFFIX
CASE 499AG
http://onsemi.com
B3
C3
A3
100 R
47 R
100 R
A2
B1
C1
C2
GND
3101
AYWW G
G
1
PIN CONFIGURATION
A3
B3
C3
A2
B2
C2
B1
C1
B2
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
A2
NUF3101FCT1G
Flip−Chip
(Pb−Free)
3000 Tape & Reel
(Note: Microdot may be in either location)
3101
= Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package


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