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NUF2441FC Datasheet(PDF) 1 Page - ON Semiconductor

Part No. NUF2441FC
Description  Integrated Passive Filter with ESD Protection
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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NUF2441FC Datasheet(HTML) 1 Page - ON Semiconductor

   
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© Semiconductor Components Industries, LLC, 2005
May, 2005 − Rev. 4
1
Publication Order Number:
NUF2441FC/D
NUF2441FC
Integrated Passive Filter
with ESD Protection
This device is designed for cell phone applications requiring
Headset and Speaker Phone, EMI Filtering and ESD Protection.
This device offers an integrated solution in a small package reducing
PCB space and cost.
Features:
Provides EMI Filtering and ESD Protection
Single IC Offers Cost Savings by Replacing 2 Inductors,
4 Capacitors, and 4 TVs Diodes
Compliance with IEC61000−4−2, (Level 4)
30 kV (Contact), 30 kV (air)
Flip−Chip Package
Moisture Sensitivity Level 1
ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
This is a Pb−Free Device*
Benefits:
Flip−Chip Package Minimizes PCB Space
Integrated Circuit Increases System Reliability versus Discrete
Component Implementation
TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
Typical Applications:
Cell Phones
Communication Circuits
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
ESD Discharge IEC61000−4−2
Contact Discharge
Air Discharge
Vpp
30
30
kV
Operating Temperature Range
TJ
−40 to +125
°C
Storage Temperature Range
Tstg
−55 to +150
°C
Lead Solder Temperature
(10 second duration)
TL
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device
Package
Shipping
ORDERING INFORMATION
NUF2441FCT1G
Flip−Chip
(Pb−Free)
3000/Tape & Reel
CIRCUIT DESCRIPTION
C1
C1
L
L
C2
C2
B3
A3
B1
A1
B2
A2
MARKING
DIAGRAM
PIN CONFIGURATION
Flip−Chip
CASE 499J
2441AYWW
A3
A1
B1
A2
B3
B2
(Bump View)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
A1
http://onsemi.com
2441
= Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
NUF2441FCT1
Flip−Chip
3000/Tape & Reel


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