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NTLJF3117P Datasheet(PDF) 3 Page - ON Semiconductor |
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NTLJF3117P Datasheet(HTML) 3 Page - ON Semiconductor |
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NTLJF3117P http://onsemi.com 3 MOSFET ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Unit Max Typ Min Test Conditions Symbol SWITCHING CHARACTERISTICS (Note 6) Turn−On Delay Time td(ON) VGS = −4.5 V, VDD = −10 V, ID = −2.0 A, RG = 2.0 W 5.5 ns Rise Time tr 15 Turn−Off Delay Time td(OFF) 19.8 Fall Time tf 21.6 DRAIN−SOURCE DIODE CHARACTERISTICS Forward Recovery Voltage VSD VGS = 0 V, IS = −1.0 A TJ = 25°C −0.75 −1.0 V TJ = 125°C −0.64 Reverse Recovery Time tRR VGS = 0 V, dISD/dt = 100 A/ms, IS = −1.0 A 16.2 ns Charge Time ta 10.6 Discharge Time tb 5.6 Reverse Recovery Time QRR 5.7 nC 5. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%. 6. Switching characteristics are independent of operating junction temperatures. SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Symbol Test Conditions Min Typ Max Unit Maximum Instantaneous Forward Voltage VF IF = 0.1 A 0.34 0.39 V IF = 1.0 A 0.47 0.53 Maximum Instantaneous Reverse Current IR VR = 30 V 17 20 mA VR = 20 V 3.0 8.0 VR = 10 V 2.0 4.5 SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (TJ = 85°C unless otherwise noted) Parameter Symbol Test Conditions Min Typ Max Unit Maximum Instantaneous Forward Voltage VF IF = 0.1 A 0.22 0.35 V IF = 1.0 A 0.40 0.50 Maximum Instantaneous Reverse Current IR VR = 30 V 0.22 2.5 mA VR = 20 V 0.11 1.6 VR = 10 V 0.06 1.2 SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (TJ = 125°C unless otherwise noted) Parameter Symbol Test Conditions Min Typ Max Unit Maximum Instantaneous Forward Voltage VF IF = 0.1 A 0.2 0.29 V IF = 1.0 A 0.4 0.47 Maximum Instantaneous Reverse Current IR VR = 30 V 2.0 20 mA VR = 20 V 1.1 10.9 VR = 10 V 0.63 8.4 SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Symbol Test Conditions Min Typ Max Unit Capacitance C VR = 5.0 V, f = 1.0 MHz 38 pF 7. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces). 8. Surface−mounted on FR4 board using the minimum recommended pad size of 30 mm2, 2 oz cu. 9. Pulse Test: pulse width v 300 ms, duty cycle v2%. 10. Switching characteristics are independent of operating junction temperatures. |
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