NCV8512

http://onsemi.com

9

CALCULATING POWER DISSIPATION IN A

SINGLE OUTPUT LINEAR REGULATOR

The maximum power dissipation for a single output

regulator (Figure 16) is:

PD(max) + [VIN(max) * VOUT(min)]IOUT(max)

(1)

) VIN(max)IQ

where:

application, and

R

qJA +

150

°C * TA

PD

(2)

package section of the data sheet. Those packages with

the die temperature below 150

°C.

In some cases, none of the packages will be sufficient to

dissipate the heat generated by the IC, and an external

heatsink will be required.

SMART

REGULATOR

®

Control

Features

Figure 16. Single Output Regulator with Key

Performance Parameters Labeled

}

HEATSINKS

A heatsink effectively increases the surface area of the

package to improve the flow of heat away from the IC and

into the surrounding air.

Each material in the heat flow path between the IC and the

outside environment will have a thermal resistance. Like

series electrical resistances, these resistances are summed to

R

qJA + RqJC ) RqCS ) RqSA

(3)

where:

functions of the package type, heatsink and the interface

between them. These values appear in heatsink data sheets

of heat sink manufacturers.

Further mounting and cooling information is available in

the application note, AN1040/D, “Mounting Considerations

for

Power

Semiconductors”

located

in

the

ON Semiconductor web site.

ORDERING INFORMATION

Device

Output Voltage

Package

NCV8512PW50G

5.0 V

SOW−16 E Pad

(Pb−Free)

47 Units / Rail

NCV8512PW50R2G

1000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.