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NCP9002 Datasheet(PDF) 3 Page - ON Semiconductor

Part No. NCP9002
Description  1.3 Watt Audio Power Amplifier with Fast Turn On Time
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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NCP9002 Datasheet(HTML) 3 Page - ON Semiconductor

 
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NCP9002
http://onsemi.com
3
PIN DESCRIPTION
Pin
Type
Symbol
Description
A1
I
INM
Negative input of the first amplifier, receives the audio input signal. Connected to the
feedback resistor Rf and to the input resistor Rin.
A2
O
OUTA
Negative output of the NCP9002. Connected to the load and to the feedback resistor Rf.
A3
I
INP
Positive input of the first amplifier, receives the common mode voltage.
B1
I
VM_P
Power Analog Ground.
B2
I
VM
Core Analog Ground.
B3
I
Vp
Positive analog supply of the cell. Range: 2.2 V−5.5 V.
C1
I
BYPASS
Bypass capacitor pin which provides the common mode voltage (Vp/2).
C2
O
OUTB
Positive output of the NCP9002. Connected to the load.
C3
I
SHUTDOWN
The device enters in shutdown mode when a low level is applied on this pin.
MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
Unit
Supply Voltage
Vp
6.0
V
Operating Supply Voltage
Op Vp
2.2 to 5.5 V
2.0 V = Functional Only
Input Voltage
Vin
−0.3 to Vcc +0.3
V
Max Output Current
Iout
500
mA
Power Dissipation (Note 2)
Pd
Internally Limited
Operating Ambient Temperature
TA
−40 to +85
°C
Max Junction Temperature
TJ
150
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Thermal Resistance Junction−to−Air
RqJA
(Note 3)
°C/W
ESD Protection
Human Body Model (HBM) (Note 4)
Machine Model (MM) (Note 5)
6000
>250
V
Latchup Current at TA = 85°C (Note 6)
±100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C.
2. The thermal shutdown set to 160
°C (typical) avoids irreversible damage on the device due to power dissipation. For further information see
page 9.
3. The RqJA is highly dependent of the PCB Heatsink area. For example, RqJA can equal 195°C/W with 50 mm
2 total area and also 135
°C/W with
500 mm2. For further information see page 10. The bumps have the same thermal resistance and all need to be connected to optimize the power
dissipation.
4. Human Body Model, 100 pF discharge through a 1.5 k
W resistor following specification JESD22/A114.
5. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
6. Maximum ratings per JEDEC standard JESD78.


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