NCP5500, NCV5500, NCP5501, NCV5501

http://onsemi.com

3

ABSOLUTE MAXIMUM RATINGS

Pin Symbol, Parameter

Symbol

Min

Max

Units

−7.0

+18

V

V

−0.3

+16

(Note 4)

V

Junction Temperature

+150

°C

Package Dissipation

DPAK 5

Thermal Resistance, Junction−to−Air

Thermal Resistance, Junction−to−Case

DPAK

Thermal Resistance, Junction−to−Air

Thermal Resistance, Junction−to−Case

Internally Limited

75

8.0

Internally Limited

101

6.6

°C/W

Storage Temperature

−55

+150

°C

Moisture Sensitivity Level

MSL

1

−

ESD Capability, Human Body Model (Note 1)

4000

−

V

ESD Capability, Machine Model (Note 1)

200

−

V

ESD Capability, Charged Device Model (Note 1)

1000

−

V

Lead Temperature Soldering

Reflow (SMD Styles Only), Pb−Free Versions (Note 3)

265 Peak

°C

OPERATING RANGES

(Note 5)

16

V

1.25

5.0

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model

2. Latch−up Current Maximum Rating: ≤ 100 mA per JEDEC standard: JESD78.

3. Pb−Free, 60 sec –150 sec above 217°C, 40 sec max at peak temperature