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NCP5181PG Datasheet(PDF) 1 Page - ON Semiconductor

Part # NCP5181PG
Description  High Voltage High and Low Side Driver
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP5181PG Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 2
1
Publication Order Number:
NCP5181/D
NCP5181
High Voltage High and Low
Side Driver
The NCP5181 is a High Voltage Power MOSFET Driver providing
two outputs for direct drive of 2 N−channel power MOSFETs arranged
in a half−bridge (or any other high−side + low−side) configuration.
It uses the bootstrap technique to insure a proper drive of the
High−side power switch. The driver works with 2 independent inputs
to accommodate any topology (including half−bridge, asymmetrical
half−bridge, active clamp and full−bridge
…).
Features
High Voltage Range: up to 600 V
dV/dt Immunity ±50 V/nsec
Gate Drive Supply Range from 10 V to 20 V
High and Low DRV Outputs
Output Source / Sink Current Capability 1.1 A / 2.4 A
3.3 V and 5 V Input Logic Compatible
Up to VCC Swing on Input Pins
Matched Propagation Delays between Both Channels
Outputs in Phase with the Inputs
Independent Logic Inputs to Accommodate All Topologies
Under VCC LockOut (UVLO) for Both Channels
Pin to Pin Compatible with IR2181(S)
These are Pb−Free Devices
Applications
High Power Energy Management
Half−bridge Power Converters
Any Complementary Drive Converters (asymmetrical half−bridge,
active clamp)
Full−bridge Converters
Bridge Inverters for UPS Systems
PIN ASSIGNMENT
PIN
FUNCTION
IN_HI
Logic Input for High Side Driver Output In Phase
IN_LO
Logic Input for Low Side Driver Output In Phase
GND
Ground
DRV_LO
Low Side Gate Drive Output
VCC
Low Side and Main Power Supply
VBOOT
Bootstrap Power Supply
DRV_HI
High Side Gate Drive Output
BRIDGE
Bootstrap Return or High Side Floating Supply Return
http://onsemi.com
MARKING DIAGRAMS
PDIP−8
P SUFFIX
CASE 626
Device
Package
Shipping
ORDERING INFORMATION
1
8
NCP5181P,
5181
= Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y, YY
= Year
W, WW = Work Week
G, G
= Pb−Free Package
5181
ALYWX
G
1
8
NCP5181P
AWL
YYWWG
SOIC−8
D SUFFIX
CASE 751
NCP5181PG
PDIP−8
(Pb−Free)
50 Units/Tube
NCP5181DR2G
SOIC−8
(Pb−Free)
2.500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
IN_HI
IN_LO
GND
DRV_LO
VBOOT
DRV_HI
BRIDGE
VCC


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