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NCP1595 Datasheet(PDF) 2 Page - ON Semiconductor |
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NCP1595 Datasheet(HTML) 2 Page - ON Semiconductor |
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NCP1595, NCP1595A http://onsemi.com 2 NCP1595 VCC VCCP EN LX FB GND R1 R2 C1 C2 L1 VOUT = 0.8 V to 0.9 x VIN VIN = 4.0 V to 5.5 V Figure 1. Typical Operating Circuit ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Power Supply (Pin 4, 5) VIN 7.0 −0.3 (DC) −1.0 (100 ns) V Input / Output Pins Pin 1,3,6 VIO 6.5, −0.3 (DC) −1.0 (100 ns) V Thermal Characteristics 3x3 DFN Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance Junction−to−Air PD RqJA 1450 68.5 mW °C/W Operating Junction Temperature Range (Note 4) TJ −40 to + 150 °C Operating Ambient Temperature Range TA −40 to + 85 °C Storage Temperature Range Tstg − 55 to +150 °C Moisture Sensitivity Level (Note 3) 1 − Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: ESD data available upon request. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model (HBM) 2.0 kV per JEDEC standard: JESD22−A114. Machine Model (MM) 200 V per JEDEC standard: JESD22−A115. 2. Latchup Current Maximum Rating: 150 mA per JEDEC standard: JESD78. 3. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A. 4. The maximum package power dissipation limit must not be exceeded. P D + T J(max) * TA RqJA |
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