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NCP1521 Datasheet(PDF) 16 Page - ON Semiconductor |
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NCP1521 Datasheet(HTML) 16 Page - ON Semiconductor |
16 / 17 page ![]() NCP1521 http://onsemi.com 16 PACKAGE DIMENSIONS TSOP−5 SN SUFFIX CASE 483−02 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM MIN MAX MIN MAX INCHES MILLIMETERS A 2.90 3.10 0.1142 0.1220 B 1.30 1.70 0.0512 0.0669 C 0.90 1.10 0.0354 0.0433 D 0.25 0.50 0.0098 0.0197 G 0.85 1.05 0.0335 0.0413 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.55 0.0493 0.0610 M 0 10 0 10 S 2.50 3.00 0.0985 0.1181 0.05 (0.002) 12 3 54 S A G L B D H C K M J _ ___ 0.7 0.028 1.0 0.039 mm inches SCALE 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* |