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NCP1423 Datasheet(PDF) 2 Page - ON Semiconductor

Part No. NCP1423
Description  400 mA Sync−Rect PFM Step−Up DC−DC Converter with True−Cutoff and Ring−Killer
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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NCP1423 Datasheet(HTML) 2 Page - ON Semiconductor

 
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NCP1423
http://onsemi.com
2
Figure 1. Typical Operation Circuit
EN
REF
FB
GND
OUT
BAT
LX
ADEN
LBI
LBO
OFF
ON
OFF
ON
R1
R2
100k
5.6
mH
10
mF
CIN
22
mF
COUT
0.1
mF
* Optional
*
Low battery
open drain output
Low battery
sense input
NCP1423
R4
R3
C1
PIN DESCRIPTION
Pin No.
Symbol
Description
1
EN
Low−Battery Detector Input and Enable. With this pin pulled down below 0.5 V, the device will be disabled
and will enter shutdown mode
2
REF
1.195 V Reference Voltage Output, bypass with 0.1
mF capacitor if this pin is not loaded, with a 1.0 mF
bypassing capacitor, this pin can be loaded up to 2.5 mA @ VOUT = 3.3 V.
3
FB
Output Voltage Feedback Input
4
GND
Ground
5
OUT
Power Output. OUT provides bootstrap power to the IC
6
BAT
Battery supply input pin and connection for internal Ring−Killer
7
LX
N−Channel and P−Channel Power MOSFET Drain
8
ADEN
Auto Discharge Input
9
LBI
Low−Battery Detector Input
10
LBO
Open−Drain Low−Battery Detector Output. Output is Low when VLBI is < 500 mV.
LBO is high impedance shutdown
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply (Pin 6)
VOUT
−0.3, 6.0
V
Input / Output Pins (Pins 1−3,5,7−10)
VIO
−0.3, 6.0
V
Thermal Characteristics
Micro10 Plastic Package, Case 846B, TA = 25°C
Thermal Resistance Junction−to−Air
PD
RqJA
480
250
mW
°C/W
Operating Junction Temperature Range
TJ
− 40 to + 150
°C
Operating Ambient Temperature Range
TA
− 40 to + 85
°C
Storage Temperature Range
Tstg
− 55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: ESD data available upon request.
1. This device contains ESD protection and exceeds the following tests:
Human Body Model (HBM)
±2.0 kV per JEDEC standard: JESD22−A114.
Machine Model (MM)
±200 V per JEDEC standard: JESD22−A115.
2. The maximum package power dissipation limit must not be exceeded.
PD +
TJ(max) * TA
R
qJA
3. Latchup Current Maximum Rating:
±150 mA per JEDEC standard: JESD78.
4. Moisture Sensitivity Level: MSL 1 per IPC/JEDEC standard: J−STD−020A.
5. Measured on approximately 1 in sq of 1 oz Cu.


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