NCP1423

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13

PACKAGE DIMENSIONS

S

B

M

0.08 (0.003)

T

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

2.90

3.10

0.114

0.122

B

2.90

3.10

0.114

0.122

C

0.95

1.10

0.037

0.043

D

0.20

0.30

0.008

0.012

G

0.50 BSC

0.020 BSC

H

0.05

0.15

0.002

0.006

J

0.10

0.21

0.004

0.008

K

4.75

5.05

0.187

0.199

L

0.40

0.70

0.016

0.028

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION “A” DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE

BURRS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.

4. DIMENSION “B” DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION

SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. 846B−01 OBSOLETE. NEW STANDARD

846B−02

−B−

−A−

D

K

G

PIN 1 ID

8 PL

0.038 (0.0015)

PLANE

C

H

J

L

mm

inches

SCALE 8:1

10X

10X

8X

1.04

0.041

0.32

0.0126

5.28

0.208

4.24

0.167

3.20

0.126

0.50

0.0196

Micro10

CASE 846B−03

ISSUE D

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

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