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NCP1381 Datasheet(PDF) 4 Page - ON Semiconductor |
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NCP1381 Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 26 page ![]() NCP1381 http://onsemi.com 4 MAXIMUM RATINGS TABLE Symbol Rating Value Unit Vsupply Maximum Power Supply Voltage on Pin 10 (VCC), Pin 9 (DRV), and Pin 11 (GTS) 20 V Maximum Current in Pin 10 (VCC) "30 mA Maximum Current in Pin 11 (GTS) "20 mA Maximum Current in Pin 9 (DRV) "1 A Power Supply Voltage on all Other Pins Except Pin 10 (VCC), Pin 9 (DRV), Pin 3 (DMG) and Pin 11 (GTS) −0.3 to 5 V Maximum Current Into All Other Pins Except Pin 10 (VCC), Pin 9 (DRV) and Pin 11 (GTS) "10 mA Idem Maximum Current in Pin 3 (DMG), When 10 V ESD Zener is Activated +3 / −3 mA RqJ−A Thermal Resistance Junction−to−Air, SO−14 150 °C/W TJMAX Maximum Junction Temperature 150 °C Storage Temperature Range −60 to +150 °C ESD Capability, Human Body Model per MIL−STD−883, Method 3015 (All Pins Except Ref) 2 kV ESD Capability, Human Body Model per MIL−STD−883, Method 3015 (Ref Pin) 1.8 kV ESD Capability, Machine Model 200 V NOTE: This device contains latchup protection and exceeds 100 mA per JEDEC standard JESD78. Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS (For typical values TJ = 25°C, for min/max values TJ = 0°C to +125°C, VCC = 12 V unless otherwise noted) Symbol Rating Pin Min Typ Max Unit SUPPLY SECTION VCCON Turn−on Threshold Level, VCC Going Up 10 13 15 17.9 V VCCOFF Minimum Operating Voltage After Turn−on 10 9 10 11 V VCClatch VCC Decreasing Level at Which the Latchoff Phase Ends 10 − 7 − V VCCreset VCC Level at Which the Internal Logic Gets Reset 10 − 4 − V Istartup Startup Current (VCC < VCCON) 10 − 2 15 mA ICC1 Internal IC Consumption, No Output Load on Pin 9, FSW = 60 kHz 10 − 1.4 1.8 mA ICC2 Internal IC Consumption, 1 nF Output Load on Pin 9, FSW = 60 kHz 10 − 2.1 2.6 mA ICC3 Internal IC Consumption, Latchoff Phase 10 − 1.4 − mA DRIVE OUTPUT Tr Output Voltage Rise−Time @ CL = 1 nF, 10−90% of Output Signal 9 − 15 − ns Tf Output Voltage Fall−Time @ CL = 1 nF, 10−90% of Output Signal 9 − 15 − ns ROH Source Resistance 9 − 9 − W ROL Sink Resistance 9 − 8 − W CURRENT COMPARATOR IIB Input Bias Current @ 1 V Input Level on Pin 7 7 − 0.02 − mA ILimit Maximum Internal Current Setpoint at VBO = 0 7 0.75 0.8 0.85 V Gm Transconductance Amplifier Offsetting CS at VBO = 2 V 7 70 85 100 mS TDELCS Propagation Delay from CS Detected to Gate Turned off (Pin 9 Loaded by 1 nF) 7 − 90 − ns TLEB Leading Edge Blanking Duration 7 300 370 − ns SStart Typical Internal Soft−start Period at Startup − 2.5 4.0 6.0 ms |