IS354 datasheet(6/6 Pages) ETC1 | HIGH DENSITY MOUNTING AC INPUT, PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS

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IS354 Datasheet(PDF) 6 Page - List of Unclassifed Manufacturers

Part No.	IS354

Description	HIGH DENSITY MOUNTING AC INPUT, PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS

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Maker	ETC1 [List of Unclassifed Manufacturers]

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IS354 Datasheet(HTML) 6 Page - List of Unclassifed Manufacturers

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12/07/01

Appendix to Mini Flat Pack FPA-AAS/A1

TEMPERATURE PROFILE OF SOLDERING REFLOW

(1) One time soldering reflow is recommended within the condition of temperature and time profile

shown below.

30 seconds

1 minute

2 minutes

1.5 minutes

1 minute

25 C

180 C

200 C

230 C

(2) When using another soldering method such as infrated ray lamp, the temperature may rise

partially in the mold of the device.

Keep the temperature on the package of the device within the condition of above (1).

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