ADN2880

Rev. 0 | Page 11 of 12

PIN Photodiode for Non-SDH/SONET Applications

VCC

OUT

OUTB

Figure 26. Coplanar PIN for a 4-Pin TO-46

0.85V

20pF

50

Ω

200

Ω

50

Ω

FILTER

IN

VCC

GND

GND

CAP

OUTB

OUT

RSSI

VCCFILTER

B.W.

B.W.

B.W.

B.W.

B.W.

B.W.

B.W.

B.W.

B.W.

Figure 27. Equivalent Circuit with Bond Wires, as Shown in Figure 26

VCC

OUT

OUTB

Figure 28. Dual Planar PIN for a 4-Pin TO-46

TO CAN HEADER

Figure 29. Side View of the Assembly, as Shown in Figure 26

Table 6. Bill of Materials (BOM)

Component

Description

PD

1× vendor specific, 2.5 Gbps, photodiode

TIA

1× ADN2880 (0.7 mm × 1.2 mm), 3.2 Gbps,

transimpedance amplifier

1× 200 pF, RF single-layer capacitor

Sc

1× ceramic standoff or 1× optional 1000 pF

capacitor

Notes

One mil thickness, gold wire, ball bond recommended.

Minimize all GND bond-wire lengths.

Minimize IN, FILTER, OUT, and OUTB bond-wire lengths.

Maintain symmetry in length and orientation between OUT

and OUTB bond wires.

Maintain symmetry in length and orientation between IN and

FILTER bond wires.

Maintain symmetry between IN/FILTER and OUT/OUTB

bond wires.