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ADN2813ACPZ-RL7 Datasheet(PDF) 21 Page - Analog Devices |
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ADN2813ACPZ-RL7 Datasheet(HTML) 21 Page - Analog Devices |
21 / 28 page ADN2813 Rev. 0 | Page 21 of 28 APPLICATIONS INFORMATION PCB DESIGN GUIDELINES Proper RF PCB design techniques must be used for optimal performance. Power Supply Connections and Ground Planes Use of one low impedance ground plane is recommended. The VEE pins should be soldered directly to the ground plane to reduce series inductance. If the ground plane is an internal plane and connections to the ground plane are made through vias, multiple vias can be used in parallel to reduce the series inductance, especially on Pin 23, which is the ground return for the output buffers. The exposed pad should be connected to the GND plane using plugged vias so that solder does not leak through the vias during reflow. Use of a 22 μF electrolytic capacitor between VCC and VEE is recommended at the location where the 3.3 V supply enters the PCB. When using 0.1 μF and 1 nF ceramic chip capacitors, they should be placed between the IC power supply VCC and VEE, as close as possible to the ADN2813 VCC pins. If connections to the supply and ground are made through vias, the use of multiple vias in parallel helps to reduce series inductance, especially on Pin 24, which supplies power to the high speed CLKOUTP/CLKOUTN and DATAOUTP/ DATAOUTN output buffers. Refer to Figure 24 for the recommended connections. By using adjacent power supply and GND planes, excellent high frequency decoupling can be realized by using close spacing between the planes. This capacitance is given by ( ) pF 0.88εr A/d C PLANE = where: ε r is the dielectric constant of the PCB material. A is the area of the overlap of power and GND planes (cm2). d is the separation between planes (mm). For FR-4, εr = 4.4 mm and 0.25 mm spacing, C ~15 pF/cm2. 50 Ω TRANSMISSION LINES DATAOUTP DATAOUTN CLKOUTP CLKOUTN 0.1 μF 22 μF 1nF 0.1 μF 0.1 μF 0.1 μF 0.1 μF 0.47 μF ±20% >300M Ω INSULATION RESISTANCE 1nF 1nF 1nF 0.1 μF 1nF + VCC 50 Ω 50 Ω CIN TIA VCC RTH VCC μC μC I2C CONTROLLER I2C CONTROLLER VCC VCC 1 TEST1 2 VCC 3 VREF 4 NIN 5 PIN 6 SLICEP 7 SLICEN 8 VEE 24 VCC 23 VEE 22 LOS 21 SDA 20 SCK 19 SADDR5 18 VCC 17 VEE EXPOSED PAD TIED OFF TO VEE PLANE WITH VIAS Figure 24. Typical ADN2813 Applications Circuit |
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