Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.COM

X  

Preview PDF Download HTML

NB3N3011 Datasheet(PDF) 6 Page - ON Semiconductor

Part No. NB3N3011
Description  3.3 V 100 MHz / 106.25 MHz PureEdge Clock Generator with LVPECL Differential Output
Download  7 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NB3N3011 Datasheet(HTML) 6 Page - ON Semiconductor

  NB3N3011 Datasheet HTML 1Page - ON Semiconductor NB3N3011 Datasheet HTML 2Page - ON Semiconductor NB3N3011 Datasheet HTML 3Page - ON Semiconductor NB3N3011 Datasheet HTML 4Page - ON Semiconductor NB3N3011 Datasheet HTML 5Page - ON Semiconductor NB3N3011 Datasheet HTML 6Page - ON Semiconductor NB3N3011 Datasheet HTML 7Page - ON Semiconductor  
Zoom Inzoom in Zoom Outzoom out
 6 / 7 page
background image
NB3N3011
http://onsemi.com
6
PC Board Layout Example
Figure 11 shows a representative board layout for the
NB3N3011. There exists many different potential board
layouts and the one pictured is but one. The crystal X1
footprint shown in this example allows installation of either
surface mount HC49S or through−hole HC49 package. The
footprints of other components in this example are listed in
Table 9. There should be at least one decoupling capacitor
per power pin. The decoupling capacitors should be located
as close as possible to the power pins. The layout assumes
that the board has clean analog power ground plane. The
important aspect of the layout in Figure 11 is the low
impedance connections between VCC and GND for the
bypass capacitors. Combining good quality general purpose
chip capacitors with good PCB layout techniques will
produce effective capacitor resonances at frequencies
adequate to supply the instantaneous switching current for
the NB3N3011 outputs. It is imperative that low inductance
chip capacitors are used. It is equally important that the
board layout not introduce any of the inductance saved by
using the leadless capacitors. Thin interconnect traces
between the capacitor and the power plane should be
avoided and multiple large vias should be used to tie the
capacitors to the buried power planes. Fat interconnect and
large vias will help to minimize layout induced inductance
and thus maximize the series resonant point of the bypass
capacitors.
The voltage amplitude across the crystal is relatively
small. It is imperative that no actively switching signals
cross under the crystal as crosstalk energy coupled to these
lines could significantly impact the jitter of the device.
Table 9. Footprint Table
Reference
Size
C1, C2
0402
C3
0805
C4, C5
0603
R2
0603
Figure 11. PC Board Layout
C2
C1
Figure 12. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q
D
Zo = 50 W
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
ORDERING INFORMATION
Device
Package
Shipping
NB3N3011DTG
TSSOP8 4.4 mm
(Pb−Free)
100 Units / Rail
NB3N3011DTR2G
TSSOP8 4.4 mm
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.


Html Pages

1  2  3  4  5  6  7 


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn