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DTA114EM3T5G Datasheet(PDF) 11 Page - ON Semiconductor |
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DTA114EM3T5G Datasheet(HTML) 11 Page - ON Semiconductor |
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11 / 12 page 
DTA114EM3T5G Series http://onsemi.com 11 PACKAGE DIMENSIONS D b1 E b e A L C H −Y− −X− X 0.08 (0.0032) Y 2X E 1 2 3 1.0 0.039 mm inches SCALE 20:1 0.40 0.0157 0.40 0.0157 0.40 0.0157 0.40 0.0157 0.40 0.0157 STYLE 1: PIN 1. BASE 2. EMITTER 3. COLLECTOR DIM MIN NOM MAX MILLIMETERS A 0.45 0.50 0.55 b 0.15 0.20 0.27 b1 0.25 0.3 0.35 C 0.07 0.12 0.17 D 1.15 1.20 1.25 E 0.75 0.80 0.85 e 0.40 BSC H 1.15 1.20 1.25 L 0.15 0.20 0.25 0.018 0.020 0.022 0.0059 0.0079 0.0106 0.010 0.012 0.014 0.0028 0.0047 0.0067 0.045 0.047 0.049 0.03 0.032 0.034 0.016 BSC 0.045 0.047 0.049 0.0059 0.0079 0.0098 MIN NOM MAX INCHES E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. SOT−723 CASE 631AA−01 ISSUE A *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOT−723 SOLDERING FOOTPRINT* |
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