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CS5421 Datasheet(PDF) 8 Page - ON Semiconductor

Part No. CS5421
Description  Dual Out?뭥f?뭁hase Synchronous Buck Controller with Remote Sense
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

CS5421 Datasheet(HTML) 8 Page - ON Semiconductor

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3. output voltage change due to the ESR and ESL of the
bulk and high frequency decoupling capacitors,
circuit traces, and vias;
4. output voltage ripple and noise.
Budgeting the tolerance is left up to the designer who must
take into account all of the above effects and provide an
output voltage that will meet the specified tolerance at the
load.
The designer must also ensure that the regulator
component temperatures are kept within the manufacturer’s
specified ratings at full load and maximum ambient
temperature.
Selecting Feedback Divider Resistors
Figure 6. Selecting Feedback Divider Resistors
VOUT
R1
R2
VFB
The feedback pins (VFB1(2)) are connected to
externalresistor dividers to set the output voltages. The error
amplifier is referenced to 1.0 V and the output voltage is
determined by selecting resistor divider values. Resistor R1
is selected based on a design trade−off between efficiency
and output voltage accuracy. The output voltage error can be
estimated due to the bias current of the error amplifier
neglecting resistor tolerance:
Error% + 1
10*6
R1
1.0
100%
R2 can be sized after R1 has been determined:
R2 + R1
VOUT
1.0 *
1.0
Calculating Duty Cycle
The duty cycle of a buck converter (including parasitic
losses) is given by the formula:
Duty Cycle + D +
VOUT ) (VHFET ) VL)
VIN ) VLFET * VHFET * VL
where:
VOUT = buck regulator output voltage;
VHFET = high side FET voltage drop due to RDS(ON);
VL = output inductor voltage drop due to inductor wire
DC resistance;
VIN = buck regulator input voltage;
VLFET = low side FET voltage drop due to RDS(ON).
Figure 7. Switching Frequency
10
20
30
40
50
60
100
200
300
400
500
600
700
800
ROSC (kW)
Selecting the Switching Frequency
Selecting the switching frequency is a trade−off between
component size and power losses. Operation at higher
switching frequencies allows the use of smaller inductor and
capacitor values. Nevertheless, it is common to select lower
frequency operation because a higher frequency results in
lower efficiency due to MOSFET gate charge losses.
Additionally, the use of smaller inductors at higher
frequencies results in higher ripple current, higher output
voltage ripple, and lower efficiency at light load currents.
The value of the oscillator resistor is designed to be
linearly related to the switching period. If the designer
prefers not to use Figure 7 to select the necessary resistor, the
following equation quite accurately predicts the proper
resistance for room temperature conditions.
ROSC +
21700 * fSW
2.31fSW
where:
ROSC = oscillator resistor in kΩ;
fSW = switching frequency in kHz.
Selection of the Output Inductor
The inductor should be selected based on its inductance,
current capability, and DC resistance. Increasing the
inductor value will decrease output voltage ripple, but
degrade transient response. There are many factors to
consider in selecting the inductor including cost, efficiency,
EMI and ease of manufacture. The inductor must be able to
handle the peak current at the switching frequency without
saturating, and the copper resistance in the winding should
be kept as low as possible to minimize resistive power loss.
There are a variety of materials and types of magnetic
cores that could be used for this application. Among them
are ferrites, molypermalloy cores (MPP), amorphous and
powdered iron cores. Powdered iron cores are very
commonly used. Powdered iron cores are very suitable due


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