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TPA3107D2 Datasheet(PDF) 6 Page - Texas Instruments

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Part No. TPA3107D2
Description  15-W STEREO CLASS-D AUDIO POWER AMPLIFIER
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TPA3107D2 Datasheet(HTML) 6 Page - Texas Instruments

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TPA3107D2
SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
TERMINAL FUNCTIONS (continued)
TERMINAL
I/O
DESCRIPTION
NAME
NO.
ROUTP
53, 54
O
Class-D 1/2-H-bridge positive output for right channel.
PVCCR
45, 46
Power supply for right channel H-bridge, not connected to PVCCL or AVCC.
BSRP
55
I/O
Bootstrap I/O for right channel, positive high-side FET.
AGND
7, 21
Analog ground for digital/analog cells in core.
ROSC
18
I/O
I/O for current setting resistor of ramp generator.
Master/Slave select for determining direction of SYNC terminal. HIGH=Master
MSTR/SLV
12
I
mode, SYNC terminal is an output; LOW = slave mode, SYNC terminal accepts a
clock input. TTL logic levels with compliance to VREG.
Clock input/output for synchronizing multiple class-D devices. Direction determined
SYNC
17
I/O
by MSTR/SLV terminal. Input signal not to exceed VREG.
Reference for preamplifier. Nominally equal to 1.25 V. Also controls start-up time
VBYP
20
O
via external capacitor sizing.
4-V regulated output for use by internal cells, GAINx, MUTE, and MSTR/SLV pins
VREG
19
O
only. Not specified for driving other external circuitry.
AVCC
64
High-voltage analog power supply. Not internally connected to PVCCR or PVCCL.
1-4, 13-16,
22-25,
NC
32-34, 39,
Not internally connected.
42, 47-49,
56-60
Connect to AGND and PGND – should be star point for both grounds. Internal
resistive connection to AGND and PGND. Thermal vias on the PCB should
Thermal Pad
-
-
connect this pad to a large copper area on an internal or bottom layer for the best
thermal performance. The Thermal Pad must be soldered to the PCB for
mechanical reliability.
6
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