040614

WebSite

www.wickmanngroup.com E-mail: sales@wickmann.com

E-mail: service@wickmannusa.com E-mail: sales@wickmann.com.hk E-mail: sales@wickmann.cn

3.45

1.78

1.78

3.15

Dimensions (mm)

Solder pad Layout (mm)

Dimensions (mm)

SMD1812P010TS/TF

0.10

0.30

30

10

1.50 @ 0.50

0.8

1.600

7.000

15.000

•

•

SMD1812P014TS/TF

0.14

0.34

60

10

0.15 @ 1.50

0.8

1.500

4.000

6.000

•

•

SMD1812P020TS/TF

0.20

0.40

30

10

0.02 @ 8.00

0.8

0.800

2.900

5.000

•

•

SMD1812P050TS/TF

0.50

1.00

15

40

0.15 @ 8.00

0.8

0.150

0.600

1.000

•

•

SMD1812P075TS/TF

0.75

1.50

13.2

40

0.20 @ 8.00

0.8

0.110

0.260

0.450

•

•

SMD1812P075TS/TF/24

0.75

1.50

24

40

0.20 @ 8.00

0.8

0.110

0.200

0.290

•

•

SMD1812P110TS/TF

1.10

2.20

6

40

0.30 @ 8.00

0.8

0.040

0.120

0.210

•

•

SMD1812P110TS/TF/15*

1.10

1.95

15

40

0.50 @ 8.00

0.8

0.060

0.120

0.180

•

•

SMD1812P110TS/TF/16

1.10

1.95

16

40

0.50 @ 8.00

0.8

0.060

0.120

0.180

•

•

SMD1812P125TS/TF

1.25

2.50

15

40

0.40 @ 8.00

0.8

0.070

0.160

0.250

•

•

SMD1812P150TS/TF

1.50

3.00

6

40

0.50 @ 8.00

0.8

0.040

0.070

0.110

•

•

SMD1812P160TS/TF

1.60

2.80

6

40

1.00 @ 8.00

0.8

0.030

0.066

0.100

•

•

SMD1812P160TS/TF/8

1.60

2.80

8

40

1.00 @ 8.00

0.8

0.030

0.066

0.100

•

•

SMD1812P200TS/TF

2.00

3.50

8

40

2.00 @ 8.00

0.8

0.020

0.040

0.060

•

•

SMD1812P260TS/TF

2.60

5.20

6

40

2.50 @ 8.00

0.8

0.015

0.030

0.047

•

•

Permissible continuous operating current is ≤ 100 % at ambient temperature of 20 ºC (68 ºF).

NOTE:

I

Hold current: maximum current device will pass without tripping in 20 °C still air.

I

Trip current: minimum current at which the device will trip in 20 °C still air.

V

Maximum voltage device can withstand without damage at rated current (I

I

Maximum fault current device can withstand without damage at rated voltage (V

P

Power dissipated from device when in the tripped state at 20 °C still air.

R

Minimum resistance of device in initial (un-soldered) state.

R

Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.

Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.

Specifications are subject to change without notice

* obsolete

Model

I

hold

I

Trip

V

max. dc

I

max.

max. time to trip

P

d max.

Resistance

Approvals

(A)

(A)

(A)

(V)

(A)

(s @ A)

(W)

R

R

Order

Qty.

Order-

Model

Packaging

Information

Number

Model

A

B

C

D

E

packaging quantity

Min Max

Min Max

Min Max

Min

Min Max

tape

SMD1812P010TS/TF

4.37 4.73

3.07

3.41

0.75

1.25

0.30

0.25

0.65

SMD1812P014TS/TF

4.37 4.73

3.07

3.41

0.75

1.95

0.30

0.25

0.65

SMD1812P020TS/TF

4.37 4.73

3.07

3.41

0.55

1.00

0.30

0.25

0.65

SMD1812P050TS/TF

4.37 4.73

3.07

3.41

0.50

0.75

0.30

0.25

0.50

SMD1812P075TS/TF

4.37 4.73

3.07

3.41

0.50

0.75

0.30

0.25

0.50

SMD1812P075TS/TF/24

4.374.73

3.07

3.41

0.75

1.55

0.30

0.25

0.65

SMD1812P110TS/TF

4.37 4.73

3.07

3.41

0.50

0.75

0.30

0.25

0.50

SMD1812P110TS/TF/15

4.374.73

3.07

3.41

0.75

1.25

0.30

0.25

0.65

SMD1812P110TS/TF/16

4.374.73

3.07

3.41

0.75

1.25

0.30

0.25

0.65

SMD1812P125TS/TF

4.37 4.73

3.07

3.41

0.75

1.25

0.30

0.25

0.50

SMD1812P150TS/TF

4.37 4.73

3.07

3.41

0.75

1.25

0.30

0.25

0.50

SMD1812P160TS/TF

4.37 4.73

3.07

3.41

0.75

1.25

0.30

0.25

0.65

SMD1812P160TS/TF/8

4.37 4.73

3.07

3.41

0.75

1.25

0.30

0.25

0.65

SMD1812P200TS/TF

4.37 4.73

3.07

3.41

0.75

1.55

0.30

0.25

0.50

SMD1812P260TS/TF

4.37 4.73

3.07

3.41

1.00

1.60

0.30

0.25

0.50

1,500

1,500

2,000

2,000

2,000

1,500

2,000

1,500

1,500

1,500

1,500

1,500

1,500

1,500

1,000

Specifications

Packaging

A

Blistertape and reel Ø 178 mm

Materials

Terminals:

Solder-plated copper

TS: Solder Material: 63/37 SnPb

TF: Lead free plating on request

Max. Device Surface Temperature in Tripped State

125 °C

Operating / Storage Temperature

-40 ºC to +85 ºC (consider derating)

Humidity Ageing

+85 °C, 85 % R.H., 1000 hours, ± 5 % typical

resistance change

Vibration

MIL-STD-883C, Method 2007.1, Condition A,

no change

Thermal Shock

MIL-STD-202F, Method 107G

+85 °C to -40 °C 20 times, -30 % typical resistance

change

Solderability

Meets EIA Specification RS186-9E,

ANSI/J-STD-002, Category 3

Reflow only

Solvent Resistance

MIL-STD-202, Method 215, no change

Marking

“P”, Part Code

SMD Type, 6 V - 60 V

Standard

CSA C22.2 No. 0 CSA TIL No. CA-3A

Approvals

cULus Recognition

TÜV

Features

This product line is also designed for surface-

mount applications. The products with 1812-mil

footprint range in hold currents from 0.1 A to

2.6 A and voltage from 6 V to 60 V. These devices

are suited for PC mother board, computer periph-

eral products and general electronics applications.

Suitable for reflow soldering.

WebLinks

Further info see:

www.wickmanngroup.com

Further application info see fuseology:

www.wickmanngroup.com/download/fuseology.pdf

SMD1812

formerly No. 729

Please choose TS for SnPb and TF for Sn plating