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CE71J3 Datasheet(PDF) 1 Page - Fujitsu Component Limited.

Part # CE71J3
Description  0.25um CMOS Technology
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Manufacturer  FUJITSU [Fujitsu Component Limited.]
Direct Link  http://edevice.fujitsu.com/fmd/en/index.html
Logo FUJITSU - Fujitsu Component Limited.

CE71J3 Datasheet(HTML) 1 Page - Fujitsu Component Limited.

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CE71 Series Embedded Array
0.25µm CMOS Technology
Features
Embedded
Hard
Macro
Fixed
Layout
Soft Macro
Fixed
Layout
Soft Macro
Clock Tree
Clk
PCI
5V Tol.
3V
PCML
• 0.18µm Leff (0.24µm drawn)
• Propagation delay of 61 ps
• Separate core and I/O supply voltages
• Mixed-signal macros–A/D and D/A converters
• I/Os: 2.5V, 3.3V, 5V tolerant
• Core power supply voltage: 2.5V, 1.8V, 1.5V
• Junction temperature: -40ºC~125ºC
• High performance and special I/Os–PCML, LVDS, PCI,
SSTL, GTL+,AGP, USB
• Analog and digital PLLs
• Packaging options: QFP, HQFP, BGA,TBGA
• Support for major third-party EDA tools
Description
Fujitsu’s CE71 is a series of high-performance, 0.18µm Leff
CMOS embedded arrays that include full support of diffused
high-speed RAMs, ROMs, mixed-signal macros, and a
variety of other embedded functions.
The CE71 series offers density and performance similar to
those of standard cells, yet provides the time-to-market
advantage of gate arrays.The CE71 series devices include
44µm, 66µm, or 88µm pad pitch for a cost-effective
solution for both pad-limited and core-limited designs.
With a nominal 1.5V to 2.5V core operation and with 2.5V
and 3.3V/5V tolerant I/Os, the CE71 series features a very
low-power consumption of 0.06µW/gate/MHz. Potential
applications for the CE71 series include computing, graphics,
communications, networking, wireless, and consumer designs.
J-Series with 66µm Stagger Pad Pitch and Wire Bonding
Frame
Total Gates
Total Pads
Signals
CE71J1
216K
192
152
CE71J2
312K
224
152
CE71J3
488K
272
178
CE71J4
703K
320
206
CE71J5
911K
360
264
CE71J6
1,098K
392
304
CE71J7
1,302K
424
360
CE71J8
1,524K
456
360
CE71J9
2.020K
520
360
CE71JA
2,586K
584
472
CE71JB
3,055K
632
472
CE71JC
3,564K
680
506
CE71JD
4,113K
728
506
CE71JE
5,114K
808
506
CE71JF
6,698K
920
506
CE71JG
8,096K
1,008
506
K-Series with 88µm Inline Pad Pitch and Wire Bonding
Frame
Total Gates
Total Pads
Signals
CE71K1
167K
100
88
CE71K2
237K
120
102
CE71K3
348K
144
126
CE71K4
524K
176
152
CE71K5
734K
208
178
CE71K6
963K
240
206
CE71K7
1,110K
256
220
CE71K8
1,559K
304
264


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