AND8002/D

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7

Package Suffix

The package suffixes are shown in the data sheet Marking Diagram. The package suffixes for all ECLinPS families and the

GigaComm family are listed in the following table.

Table 7. ECLinPS and GigaComm Package Suffixes

Suffix

Package

Pins

Case

Description

BA

FCBGA−16

16

489

Ball Grid Array

D

SO−8

8

751

Small Outline IC

D

SO−16

16

751B

Small Outline IC

DT

TSSOP−8

8

948R

Thin Shrink Small Outline Package

DT

TSSOP−16

16

948F

Thin Shrink Small Outline Package

DT

TSSOP−20

20

948E

Thin Shrink Small Outline Package

DW

SO−20

20

751D

Small Outline IC

FA

LQFP−32

32

873A

Leaded Quad Flat Pack

FA

LQFP−52

52

848−D

Leaded Quad Flat Pack

FA

LQFP−52

52

848H

Leaded Quad Flat Pack

FA

LQFP−64

64

848G

Leaded Quad Flat Pack

FN

PLCC−20

20

775

Plastic Leaded Chip Carrier

FN

PLCC−28

28

776

Plastic Leaded Chip Carrier

L

CDIP−16

16

620

Ceramic DIP

M

EIAJ SO−14

14

965

EIAJ Small Outline IC

MN

QFN−24

24

485L

Quad Flat No−Lead

L

CDIP−16

16

620

Ceramic DIP

P

PDIP−16

16

648

Plastic DIP

Shipping Specification

The “Shipping” column in the Ordering Information table specifies the shipping configuration that corresponds to the device

order number. Add R2 to the regular package suffix to order tape and reel shipping configurations. Refer to Brochure

BRD8011/D for further tape and reel information.