ZXMP6A17DN8

PROVISIONAL ISSUE A - SEPTEMBER 2002

2

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient (a)(d)

100

°C/W

Junction to Ambient (b)(e)

70

°C/W

Junction to Ambient (b)(d)

60

°C/W

THERMAL RESISTANCE

Notes

(a) For a dual device surface mounted on 25mm x 25mm FR4 PCB with coverage of single sided 1oz copper in still air conditions.

(b) For a dual device surface mounted on FR4 PCB measured at t

10 sec.

(c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10µs - pulse width limited by maximum junction temperature.

(d) For a dual device with one active die.

(e) For dual device with 2 active die running at equal power.

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

-60

V

Gate-Source Voltage

20

V

-3.1

-2.4

-2.3

A

A

A

Pulsed Drain Current (c)

-11.1

A

Continuous Source Current (Body Diode)(b)

-3.0

A

Pulsed Source Current (Body Diode)(c)

-11.1

A

Power Dissipation at TA=25°C (a)(d)

Linear Derating Factor

1.25

10

W

mW/°C

Power Dissipation at TA=25°C (a)(e)

Linear Derating Factor

1.81

14.5

W

mW/°C

Power Dissipation at TA=25°C (b)(d)

Linear Derating Factor

2.15

17

W

mW/°C

Operating and Storage Temperature Range

-55 to +150

°C

ABSOLUTE MAXIMUM RATINGS.