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HMC581LP6 Datasheet(PDF) 5 Page - Hittite Microwave Corporation

Part No. HMC581LP6
Description  HIGH IP3 RFIC DUAL DOWNCONVERTER, 800 - 960 MHz
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Maker  HITTITE [Hittite Microwave Corporation]
Homepage  http://www.hittite.com
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HMC581LP6 Datasheet(HTML) 5 Page - Hittite Microwave Corporation

   
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Outline Drawing
Absolute Maximum Ratings
RF / IF Input (Vdd= +5V)
+13 dBm
LO Drive (Vdd= +5V)
+15 dBm
Vdd (LO or IF)
+7 Vdc
Channel Temperature
150°C
Continuous Pdiss (T = 85°C)
(derate 25.5 mW/°C above 85°C)
1.64 W
Thermal Resistance
(channel to ground paddle)
39.6 °C/W
Storage Temperature
-65 to +150°C
Operating Temperature
-40 to +85°C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC581LP6
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
H581
XXXX
HMC581LP6E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
H581
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
HIGH IP3 RFIC DUAL
DOWNCONVERTER, 800 - 960 MHz
v00.0806
HMC581LP6 / 581LP6E


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