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ADT6501 Datasheet(PDF) 11 Page - Analog Devices

Part No. ADT6501
Description  Low Cost, 2.7 V to 5.5 V, Micropower Temperature Switches in SOT-23
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADT6501 Datasheet(HTML) 11 Page - Analog Devices

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Preliminary Technical Data
ADT6501/ADT6502/ADT6503/ADT6504
Rev. PrA | Page 11 of 16
TEMPERATURE MONITORING
The ADT6501/ADT6502/ADT6503/ADT6504 are ideal for
monitoring the thermal environment within electronic
equipment. For example, the surface-mount package accurately
reflects the exact thermal conditions that affect nearby
integrated circuits.
The ADT650x measure and convert the temperature at the
surface of its own semiconductor chip. When the ADT650x are
used to measure the temperature of a nearby heat source, the
thermal impedance between the heat source and the ADT650x
must be as low as possible.
As much as 60% of the heat transferred from the heat source to
the thermal sensor on the ADT650x die is discharged via the
copper tracks, package pins, and bond pads. Of the pins on the
ADT650x, the GND pins transfer most of the heat. Therefore,
to monitor the temperature of a heat source it is recommended
that the thermal resistance between the ADT650x GND pins
and the GND of the heat source is reduced as much as possible.
For example, use the unique properties of the ADT650x to
monitor a high power dissipation microprocessor. The
ADT650x device, in its SOT-23 package, is mounted directly
beneath the microprocessor’s pin grid array (PGA) package.
The ADT650x requires no external characterization.


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