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LP5996SD-1525 Datasheet(PDF) 6 Page - National Semiconductor (TI) |
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LP5996SD-1525 Datasheet(HTML) 6 Page - National Semiconductor (TI) |
6 / 14 page Electrical Characteristics(Notes 2, 8) (Continued) Unless otherwise noted, V EN = 950mV, VIN =VOUT + 1.0V, or 2.0V, whichever is higher, where VOUT is the higher of VOUT1 and V OUT2.CIN = 1 µF, IOUT = 1 mA, COUT1 =COUT2 = 1.0µF. Typical values and limits appearing in normal type apply for TA = 25˚C. Limits appearing in boldface type apply over the full junction temperature range for operation, −40 to +125˚C. Symbol Parameter Conditions Typ Limit Units Min Max PSRR Power Supply Rejection Ratio (Note 11) f = 1kHz, I OUT = 1mA to 150mA C BYP = 10nF LDO1 58 dB LDO2 70 f = 20kHz, I OUT = 1mA to 150mA C BYP = 10nF LDO1 45 LDO2 60 e n Output noise Voltage (Note 11) BW = 10Hz to 100kHz C BYP = 10nF V OUT = 0.8V 36 µV RMS V OUT = 3.3V 75 T SHUTDOWN Thermal Shutdown Temperature 160 ˚C Hysteresis 20 Enable Control Characteristics I EN Input Current at V EN1 or VEN2 V EN = 0.0V 0.005 0.1 µA V EN =6V 2 5 V IL Low Input Threshold 0.4 V V IH High Input Threshold 0.95 V Timing Characteristics T ON Turn On Time (Note 11) To 95% Level C BYP = 10nF 300 µs Transient Response Line Transient Response | δV OUT| (Note 11) T rise =Tfall = 10µs δV IN = 1VCBYP = 10nF 20 mV (pk - pk) Load Transient Response | δV OUT| (Note 11) T rise =Tfall = 1µs LDO 1 I OUT = 1mA to 150mA 175 LDO 2 I OUT = 1mA to 300mA 150 Note 1: Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: All Voltages are with respect to the potential at the GND pin. Note 3: For detailed soldering specifications and information, please refer to National Semiconductor Application Note AN-1187, Leadless Leadframe Package. Note 4: Internal thermal shutdown circuitry protects the device from permanent damage. Note 5: The human body model is 100pF discharged through a 1.5k Ω resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. Note 6: The maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op) = 125˚C), the maximum power dissipation of the device in the application (PD(max)), and the junction to ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA(max) =TJ(max-op) -(θJA xPD(max)). Note 7: Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power dissipation is possible, special care must be paid to thermal dissipation issues in board design. Note 8: Min Max limits are guaranteed by design, test or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm. Note 9: VIN(MIN) =VOUT(NOM) + 0.5V, or 2.0V, whichever is higher. Note 10: Dropout voltage is voltage difference between input and output at which the output voltage drops to 100mV below its nominal value. This parameter only for output voltages above 2.0V Note 11: This electrical specification is guaranteed by design. www.national.com 6 |
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