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S29WS128N0PBFI010 Datasheet(PDF) 8 Page - SPANSION |
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S29WS128N0PBFI010 Datasheet(HTML) 8 Page - SPANSION |
8 / 95 page 8 S29WSxxxN MirrorBit™ Flash Family S29WSxxxN_00_F0 October 29, 2004 Pr e l i m i n a r y 4 Physical Dimensions/Connection Diagrams This section shows the I/O designations and package specifications for the S29WSxxxN. 4.1 Related Documents The following documents contain information relating to the S29WSxxxN devices. Click on the title or go to www.amd.com/flash (click on Technical Documentation) or www.fujitsu.com to download the PDF file, or request a copy from your sales office. Migration to the S29WS256N Family Application Note Considerations for X-ray Inspection of Surface-Mounted Flash Integrated Cir- cuits 4.2 Special Handling Instructions for FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is ex- posed to temperatures above 150°C for prolonged periods of time. |
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