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S29GL032M Datasheet(PDF) 19 Page - SPANSION

Part # S29GL032M
Description  256,128,64,32,Megabit 3.0 Volt-only Page Mode Flash Memory featuring 0.23 關m MirrorBit Process Technology
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Manufacturer  SPANSION [SPANSION]
Direct Link  http://www.spansion.com
Logo SPANSION - SPANSION

S29GL032M Datasheet(HTML) 19 Page - SPANSION

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October 10, 2006 S29GL-M_00_B6
S29GL-M MirrorBitTM Flash Family
17
Data
Sheet
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. This package is recommended for new designs using TSOPs.
3. TSOP package marking omits packing type designator from the ordering part number.
4. BGA package marking omits leading “S29” and packing type designator from the ordering part number.
5. 100% Matte Sn is used for Pb-free TSOP plating.
6. SnBi is used for Pb-free TSOP plating.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
Table 1. S29GL032M Ordering Options
S29GL032M Valid Combinations
Package Description
(Notes)
Device
Number
Speed
Option
Package, Material,
& Temperature Range
Model
Number
Packing
Type
S29GL032M
90
TAC,TFC
R0
0,2,3
(Note 1)
TS040 (2, 3, 5)
TSOP
BAC,BFC
FBC048 (4)
Fine-Pitch BGA
TAC,TFC
R1,R2
TS056 (2, 3, 5)
TSOP
FAC,FFC
LAA064 (4)
Fortified BGA
TAC,TFC
R3,R4
TS048 (2, 3, 5)
TSOP
BAC,BFC
FBC048 (4)
Fine-Pitch BGA
FAC,FFC
LAA064 (4)
Fortified BGA
90, 10, 11
TAI,TFI
R0
TS040 (2, 3, 5)
TSOP
BAI,BFI
FBC048 (4)
Fine-Pitch BGA
TAI,TFI
R1,R2
TS056 (2, 3, 5)
TSOP
FAI,FFI
LAA064 (4)
Fortified BGA
TAI,TFI
R3,R4
TS048 (2, 3, 5)
TSOP
BAI,BFI
FBC048 (4)
Fine-Pitch BGA
FAI,FFI
LAA064 (4)
Fortified BGA
TBI,TCI
FPT-48P-M19 (3, 6)
TSOP


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