This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design

in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.

Publication Number S75NS-N_00

Revision 01E

Issue Date May 3, 2006

Features

„ Power supply voltage of 1.7 V to 1.95 V

„ Burst Speed: 66 MHz

„ Package - MCP BGA: 0.5 mm ball pitch

– 11 x 13 x 1.4 mm, 112 ball

„ Operating Temperature

– Wireless, –25°C to +85°C

General Description

The S75NS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of the following items:

„ S29NS-N

„ S30MS-P

„ Mux pSRAM

The products covered by this document are listed in the tables below.

Product Selector Guide

For detailed specifications, please refer to the individual data sheets:

S75NS-N

S29NS-N: MirrorBit

Write, Burst-mode Multiplexed Flash (NOR Interface)

Multiplexed Synchronous pSRAM

Data Sheet (Advance Information)

S29NS128 +

pSRAM

32 Mb

S30MS512P

S75NS128NBF

S30MS01GP

S75NS128NBG

Device

pSRAM Density

pSRAM Type

S75NS128NBF

32 Mb

Multiplexed pSRAM Type 3

S75NS128NBG

32 Mb

Multiplexed pSRAM Type 3

Document

Publication Identification Number

S29NS-N

S29NS-N_00

S30MS-P

S30MS-P_00

32 Mb Multiplexed pSRAM Type 3

muxpsram_04