S75WS256NDFBAWMB datasheet(3/216 Pages) SPANSION

Part #	S75WS256NDFBAWMB

Description	Stacked Multi-Chip Product (MCP)

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Publication Number S75WS-N-00

Revision A Amendment 0 Issue Date February 17, 2005

General Description

The S75WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists

of the following items:

One or more S29WSxxxN code Flash

CellularRAM

One or more S29RS-N data storage Flash

The products covered by this document are listed in the table below:

Distinctive Characteristics

MCP Features

Power supply voltage of 1.7 V to 1.95 V

High Performance

— 54 MHz, 66 MHz

Packages

—9 x 12 mm 84 ball FBGA

Operating Temperature

— Wireless, –25°C to +85°C

S75WS256Nxx Based MCPs

Stacked Multi-Chip Product (MCP)

256 Megabit (16M x 16-bit) CMOS 1.8 Volt-only

Simultaneous Read/Write, Burst-mode Flash Memory with

128 Mb (8M x 16-Bit) CellularRAM and

512 Mb (32M x 16-bit) Data Storage

Data Sheet

PRELIMINARY

Device

Code Flash

Density

RAM

Density

Data Storage

Flash Density

256 Mb

128 Mb

512 Mb

S75WS256NDF

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S75WS256NDFBAWMB Datasheet(PDF) 3 Page - SPANSION

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