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S29CL016J0JDGH014 Datasheet(PDF) 11 Page - SPANSION |
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S29CL016J0JDGH014 Datasheet(HTML) 11 Page - SPANSION |
11 / 15 page September 20, 2006 Revision A2 S29CD016J/S29CL016J Known Good Die 11 Supplement (Adv an ce Inf o r m atio n) Figure 6.1 Spansion KGD Product Test Flow Electronic marking is programmed into every KGD for the purpose of traceability. The electronic marking contains wafer lot number, wafer number of origin, die location on the wafer, mask revision, test program revision, test dates, and speed grade. Figure 6.1 illustrates the steps where specific electronic marking information is programmed. For more information regarding electronic marking, reference the S29CD016J Electronic Marking Data Sheet Supplement. Wafer Sort 1 Bake 24 hours at 250°C Wafer Sort 2 Wafer Sort 3 High Temperature Packaging for Shipment Shipment DC Parameters Functionality Programmability Erasability DC Parameters Functionality Programmability Erasability Data Retention DC Parameters Functionality Programmability Erasability Speed Incoming Inspection Wafer Saw Die Separation 100% Visual Inspection Die Pack Electronic Marking Step 1: Wafer sort, test 1 & 2 information Electronic Marking Step 2: Final class or KGD test information & device speed |
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