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SY89854U Datasheet(PDF) 6 Page - Micrel Semiconductor |
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SY89854U Datasheet(HTML) 6 Page - Micrel Semiconductor |
6 / 13 page Micrel, Inc. SY89854U June 2005 M9999-060905 hbwhelp@micrel.com or (408) 955-1690 6 AC Electrical Characteristics (8) VCC = +2.5V ±5% or +3.3V ±10%; TA = –40°C to + 85°C, RL = 50Ω to VCC–2V, unless otherwise stated. Symbol Parameter Condition Min Typ Max Units fMAX Maximum Operating Frequency Clock, VOUT ≥ 400mV 2.0 3.5 GHz NRZ Data 2.5 Gbps tpd Propagation Delay (IN-to-Q) VIN ≥ 100mVpk 140 220 340 ps tpd Tempco Differential Propagation Delay Temperature Coefficient 100 fs/ oC tSKEW Output-to-Output Skew Note 9 4 20 ps Part-to-Part Skew Note 10 150 ps Note 11 1 ps(rms) Random Jitter (RJ) Deterministic Jitter (DJ) Note 12 10 ps(pp) tJitter Cycle-to-Cycle Jitter Total Jitter Note 13 Note 14 1 10 ps(rms) ps(pp) tr, tf Output Rise/Fall Time (20% to 80%) At full output swing. 50 100 180 ps Notes: 8. High-frequency AC-parameters are guaranteed by design and characterization. 9. Output-to-output skew is measured between outputs under identical conditions. 10. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the respective inputs. Part-to-part skew includes variation in tpd. 11. Random jitter is measured with a K28.7 character pattern, measured at 2.5Gbps. 12. DJ is measured at 2.5Gbps, with both K28.5 and 2 23 – 1 PRBS pattern. 13. Cycle-to-cycle jitter definition: The variation of periods between adjacent cycles, Tn – Tn-1 where T is the time between rising edges of the output signal. 14. Total jitter definition: with an ideal clock input of frequency <fMAX, no more than one output edge in 10 12 output edges will deviate by more than the specified peak-to-peak jitter value. |
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