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AH312-S8G Datasheet(PDF) 7 Page - WJ Communication. Inc. |
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AH312-S8G Datasheet(HTML) 7 Page - WJ Communication. Inc. |
7 / 7 page Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 7 of 7 March 2006 AH312 2 Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM AH312-S8G (Lead-Free Package) Mechanical Information This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes. Outline Drawing Mounting Configuration / Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature (1) -40 to +85 °C Thermal Resistance (2), Rth 17.5 °C / W Junction Temperature (3), Tjc 155 °C Notes: 1. The amplifier can be operated at 105 °C case temperature for up to 1000 hours over its lifetime without degradation in performance and will not degrade device operation at the recommended maximum 85 °C case temperature for the rest of its lifetime. 2. The thermal resistance is referenced from the junction-to-case at a case temperature of 85 °C. Tjc is a function of the voltage at pins 6 and 7 and the current applied to pins 6, 7, and 8 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 3. This corresponds to the typical biasing condition of +5V, 800 mA at an 85 °C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 °C. Product Marking The component will be marked with an “AH312G” designator with an alphanumeric lot code on the top surface of the package. The obsoleted tin-lead version will have been marked with an “AH312-S8” or “ECP200G” designator. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 2 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8. All dimensions are in millimeters (inches). Angles are in degrees. MTTFvs. GNDTabTemperature 100 1000 10000 100000 60 70 80 90 100 110 120 TabTemperature(°C) |
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