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AG201-86 Datasheet(PDF) 6 Page - WJ Communication. Inc. |
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AG201-86 Datasheet(HTML) 6 Page - WJ Communication. Inc. |
6 / 6 page Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 6 of 6 June 2005 AG201-86 InGaP HBT Gain Block Product Information The Communications Edge TM AG201-86G (Green / Lead-free Sot-86 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded (maximum 245 qC reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper. Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 qC Thermal Resistance, Rth (1) 395 qC/W Junction Temperature, Tjc (2) 117 qC 1. The thermal resistance is referenced from the hottest part of the junction to the ground lead (pin 2 or 4). 2. This corresponds to the typical biasing condition of +4V, 20 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 177 C. Product Marking The component will be marked with an “ L” designator followed by a two-digit numeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “ Application Notes” section. MSL / ESD Rating ESD Rating: Class 1C Value: Passes at 1000 V min. Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: Class IV Value: Passes at 1000 V min. Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Lead Temperature 10 100 1000 10000 60 70 80 90 100 110 Ground Lead Temperature (°C) |
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