Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.COM

X  

Preview PDF Download HTML

AD8392A Datasheet(PDF) 4 Page - Analog Devices

Part No. AD8392A
Description  Low Power, High Output Current, Quad Op Amp, Dual-Channel ADSL/ADSL2 Line Driver
Download  12 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Maker  AD [Analog Devices]
Homepage  http://www.analog.com
Logo 

AD8392A Datasheet(HTML) 4 Page - Analog Devices

 
Zoom Inzoom in Zoom Outzoom out
 4 / 12 page
background image
AD8392A
Rev. 0 | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage
±13 V (+26 V)
Power Dissipation
See Figure 3
Storage Temperature Range
−65°C to +150°C
Operating Temperature Range
−40°C to +85°C
Lead Temperature (Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is specified
for the device soldered in the circuit board for surface-mount
packages.
Table 3.
Package Type
θJA
Unit
LFCSP-32 (CP)
27.27
°C/W
TSSOP-28/EP (RE)
35.33
°C/W
Maximum Power Dissipation
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). Assuming that the load (RL) is midsupply,
the total drive power is VS/2 × IOUT, some of which is dissipated
in the package and some in the load (VOUT × IOUT).
RMS output voltages should be considered. If RL is referenced
to VS− as in single-supply operation, the total power is VS × IOUT.
In single supply with RL to VS−, worst case is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θJA.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the LFCSP-32 and
TSSOP-28/EP packages on a JEDEC standard 4-layer board.
θJA values are approximations.
0
1
2
3
4
5
6
7
–40 –30 –20 –10
0
10
20
30
40
50
60
70
80
90
TEMPERATURE (°C)
TJ = 150°C
LFCSP-32
TSSOP-28/EP
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
See the Thermal Considerations section for additional thermal
design guidance.
ESD CAUTION


Html Pages

1  2  3  4  5  6  7  8  9  10  11  12 


Datasheet Download




Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ]  

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Alldatasheet API   |   Link Exchange   |   Manufacturer List
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn