values in the typical application circuit are used (L = 3.0µH, (DCR = 0.12

Ω, FDK MIPW3226D3R0M);

C

(10V, 0402, TDK C1005X5R1A104KT) (or 220nF, (6.3V, 0402, TDK C1005X5R0J224KT))) . These parameters are not

guaranteed by production testing. Min and Max values are specified over the V

ent temp range T

25˚C unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

LDO

PSRR

Power Supply Rejection

Ratio

Offset Freq = 1Khz, C

I

50

dB

V

LDO(NOISE)

Output Noise Voltage

BW = 10Hz to 100Khz, I

30

uVrms

t

LDO, ON

Time to reach 90% of

V

LDO(nom)

after EN

LDO

signal goes high.

C

be fully functional before EN

high. PV

3uS

C

be fully functional before EN

high. PV

5uS

t

LDO, OFF

Time to reach 10% of

V

LDO(nom)

after EN

LDO

signal goes low.

C

(Note 12)

3

uS

C

(Note 12)

5

Switcher

T

RESPONSE

(Rise time)

Time for V

from 0.8V to 3.6V

PV

R

Ω

20

30

µs

T

time)

Time for V

from 3.6V to 0.8V

PV

R

Ω

20

30

µs

C

CON

V

V

Test frequency = 100 kHz

20

pF

V

Linearity in control

range 0.32V to 1.44V

PV

-3

+3

%

T

_ON

Turn on time

(time for output to reach

3.6V from Enable low to

high transition)

EN = Low to High, PV

V

I

OUT

≤ 1mA

70

100

µs

η

Efficiency

(L = 3.0µH, DCR

≤

100m

Ω)

PV

81

%

PV

95

%

V

O_ripple

Ripple voltage, PWM

mode

PV

I

10

mVp-p

Line_tr

Line transient response

PV

T

I

50

mV

Load_tr

Load transient response PV

transients up to 100mA,

T

50

mV

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of

the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the

Electrical Characteristics tables.

Note 2: All voltages are with respect to the potential at the GND pins. The LM3207 is designed for mobile phone applications where turn-on after power-up is

controlled by the system controller and where requirements for a small package size overrule increased die size for internal Under Voltage Lock-Out (UVLO) circuitry.

Thus, it should be kept in shutdown by holding the EN pin low until the input voltage exceeds 2.7V.

130˚C (typ.).

Note 4: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be

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