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CG0402MLA-26KG Datasheet(PDF) 3 Page - Bourns Electronic Solutions |
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CG0402MLA-26KG Datasheet(HTML) 3 Page - Bourns Electronic Solutions |
3 / 4 page ChipGuard ® MLA Series Varistor ESD Clamp Protectors Specifications are subject to change without notice. Customers should verify device performance in their specific applications. Product Dimensions DIMENSIONS = MM (INCHES) L W B A Recommended Pad Layout A C B D • This product can be damaged by rapid heating, cooling or localized heating. • Heat shocks should be avoided. Preheating and gradual cooling recommended. • Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. • Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Solder Reflow Recommendations 110 sec. (min.) 300 250 200 150 100 50 0 30-70 sec. 120 sec. (min.) Preheat Stages 1-3 Soldering Cooling Time (seconds) Dimension CG0402MLA CG0603MLA Series Series L 1.00 ± 0.15 1.60 ± 0.20 (0.04 ± 0.006) (0.064 ± 0.008) W 0.50 ± 0.10 0.80 ± 0.20 (0.02 ± 0.004) (0.032 ± 0.008) A 0.50 ± 0.10 0.80 ± 0.20 (0.02 ± 0.004) (0.032 ± 0.008) B 0.25 ± 0.15 0.30 ± 0.20 (0.010 ± 0.006) (0.012 ± 0.008) Dim. CG0402MLA CG0603MLA Series Series A 0.51 0.76 (0.020) (0.030) B 0.61 1.02 (0.024) (0.040) C 0.51 0.50 (0.020) (0.020) D 1.70 2.54 (0.067) (0.100) A Stage 1 Preheat Ambient to Preheating 30 s to 60 s Temperature B Stage 2 Preheat 140 °C to 160 °C 60 s to 120 s C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s D Main Heating 200 °C 60 s to 70 s 210 °C 55 s to 65 s 220 °C 50 s to 60 s 230 °C 40 s to 50 s 240 °C 30 s to 40 s E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s |
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