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BA792 Datasheet(PDF) 3 Page - NXP Semiconductors

Part No. BA792
Description  Band-switching diode
Download  8 Pages
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Maker  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
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BA792 Datasheet(HTML) 3 Page - NXP Semiconductors

   
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1996 Mar 13
3
Philips Semiconductors
Product specification
Band-switching diode
BA792
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
Note
1. Device mounted on a printed-circuit board measuring 11
× 25 × 1.6 mm.
SYMBOL
PARAMETER
CONDITIONS
MAX.
UNIT
VF
forward voltage
IF = 100 mA
1.1
V
IR
reverse current
VR = 20 V
10
nA
VR = 20 V; Tamb =75 °C1
µA
Cd
diode capacitance
VR = 3 V; f = 1 to 100 MHz; note 1
1.1
pF
rD
diode forward resistance
IF = 3 mA; f = 200 MHz; note 1
0.7
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient
note 1
315
K/W
MOUNTING
Reflow soldering
Follow standard reflow soldering techniques to ensure
correct application of solder paste and placement of the
SOD110 package (see Fig.2).
Dimensions in mm.
Fig.2 SOD110 reflow soldering pattern.
handbook, halfpage
MGC119
,,
,,
,,,
,,,
3.00
1.25
1.00
1.00
,,
,,
,,,
,,,
Wave soldering
Before wave soldering, attach SOD110 packages to the
printed-circuit boards using a small dot of thermo-setting
epoxy or UV-curing adhesive centred between the
soldering lands (see Fig.3).
Dimensions in mm.
Fig.3 SOD110 wave soldering pattern.
handbook, halfpage
MGC126
,,
,,
3.40
1.25
1.10
,,
,,
,,,
,,,
1.10
,,,
,,,


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