SHT1x / SHT7x Relative Humidity & Temperature Sensor System
www.sensirion.com
v2.01 March 2003
7/9
5 Package Information
5.1 SHT1x (surface mountable)
Table 10 SHT1x Pin Description
5.1.1
Package type
The SHT1x is supplied in a surface-mountable LCC
(Leadless Chip Carrier) type package. The sensors housing
consists of a Liquid Crystal Polymer (LCP) cap with epoxy
glob top on a standard 0.8 mm FR4 substrate. The device is
free of lead, Cd and Hg.
Device size is 7.42 x 4.88 x 2.5 mm (0.29 x 0.19 x 0.1 inch)
Weight 100 mg
The production date is printed onto the cap in white numbers
in the form wwy. e.g. ”351” = week 35, 2001.
5.1.2
Delivery Conditions
The SHT1x are shipped in standard IC tubes by 80 units per
tube or in 12mm tape. Reels are individually labelled with
barcode and human readable labels.
Cover Tape
Carrier Tape
Leader Tape
500mm minimum
Trailer Tape
300mm minimum
Components
Figure 12 Tape configuration and unit orientation
5.1.3
Mounting Examples
housing
sing
hou g
si
h
ngg
ou
PCB
Figure 13 SHT1x housing mounting example
Figure 14 SHT1x PCB Mounting example
5.1.4
Soldering Information
Standard reflow soldering ovens may be used at maximum
235 °C for 20 seconds.
For manual soldering contact time must be limited to 5
seconds at up to 350 °C.
After soldering the devices should be stored at >74 %RH for
at least 24h to allow the polymer to rehydrate.
Please consult the application note “Soldering procedure” for
more information.
Pin Name
Comment
1
GND
Ground
2
DATA
Serial data, bidirectional
3
SCK
Serial clock, input
4
VDD
Supply 2.4 – 5.5 V
NC
Remaining pins must be left unconnected
7.08 (0.278)
4.88 (0.19)
2.44
(0.1)
1
2
3
4
sensor opening
NC
NC
NC
NC
NC
NC
1.9
(0.07)
1.49
(0.06)
1.15
(0.04)
actual size
Top View
Side View
Recommended PCB Footprint
1.8
(0.07)
1.8
(0.07)
3.48 (0.137)
Figure 15 SHT1x drawing and footprint dimensions in mm (inch)
Slit to minimize heat
transfer from the PCB
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