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LM1229 Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part No. LM1229
Description  I2C Compatible CMOS TV RGB and Deflection Processor
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Maker  NSC [National Semiconductor (TI)]
Homepage  http://www.national.com
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LM1229 Datasheet(HTML) 5 Page - National Semiconductor (TI)

 
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OSD Electrical Characteristics (Continued)
Unless otherwise noted: T
A = 25˚C, VCC = +5.0V. See (Note 7) for Min and Max parameters and (Note 6) for Typicals.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
BOTH MODES
I
LOW
Low input current (OSD and
Enable).
V
IN =0V
−3.0
µA
I
HIGH
High input current (OSD and
Enable).
V
IN =5V
.001
µA
SEP
10 kHz
Crosstalk from video @ 10 kHz.
See (Note 17).
−70
dB
SEP
10 MHz
Crosstalk from video @ 10 MHz.
See (Note 17).
−50
dB
DAC Output Electrical Characteristics
Unless otherwise noted: T
A = 25˚C, VCC = +5.0V, VIN = 0.7V, VABL =VCC,CL = 10 pF, Video Outputs = 2.4 VP-P. See (Note 7)
for Min and Max parameters and (Note 6) for Typicals. DAC parameters apply to all 3 DACs.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
V
DAC MIN
Minimum DAC output voltage
Register Value = 0x00
0.5
V
V
DAC MAX MODE 0
Maximum DAC output voltage (full
scale)
Register Value = 0xFF,
GLOBAL[5] = 0.
4.2
V
V
DAC MAX MODE 1
Maximum DAC output voltage (half
scale)
Register Value = 0xFF,
GLOBAL[5] = 1.
2.1
V
∆V
DAC TEMP
DAC output voltage variation with
temperature
0˚C < T < 70˚C ambient
0.5
mV/˚C
∆V
DAC VCC
DAC output voltage variation with
V
CC
4.75V
≤ V
CC
≤ 5.25V,
DAC register set to mid-range
(0x7F)
50
mV
Linearity
Linearity of DAC over its range
5
%
Monotonicity
Monotonicity of the DAC excluding
dead zones
−0.5
+0.5
LSB
I
MAX
Maximum DAC output load current
1.0
mA
Deflection Signal Characteristics
Unless otherwise noted: T
A = 25˚C, VCC = +5.0V, VIN = 0.7V, VABL =VCC,CL = 10 pF, See (Note 7) for Min and Max param-
eters and (Note 6) for Typicals.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
f
XTL
Ceramic resonator input frequency
12
MHz
V
HFB
Switching threshold for detecting
horizontal flyback on pin 18.
2.4
V
t
FW
Flyback Width
1
µs
V
VFB-DC
DC bias point of VFB input
1.25
V
V
VFB-SW
Switching threshold for detection
1.75
V
V
X-RAY
X-Ray Threshold Voltage
Above V
X-RAY the HDRIVE output is
disabled (high)
2.5
3.2
V
V
CCforXRAYRESET
X-Ray Reset
V
CC required to reset X-Ray
4
V
∆f
FR
Free-run frequency tolerance
(ceramic resonator tolerance)
±1%
f
CR
PLL capture range
±6%
t
HDPHASE
Horizontal phase control range
All scan frequencies
±25
%T
H
t
PARCOR
Maximum parallelogram correction
Measured at 31 kHz
±1µs
t
BOWCOR
Maximum pin balance (bow)
correction
Measured at 31 kHz
±0.5
µs
H
EHT−
HEHT phase shift left (R
EHT = 20k)
HEHT[3:0] = 0011b and V
20 = 1.5V
−2.7
%T
H
H
EHT+
HEHT phase shift right (R
EHT =
20k)
HEHT[3:0] = 0111b and V
20 = 3.5V
2.8
%T
H
V
HDOL
HDRIVE Max low level output
I
OL =10mA
0.7
V
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