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NTP45N06L Datasheet(PDF) 3 Page - ON Semiconductor |
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NTP45N06L Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 8 page NTP45N06L, NTB45N06L http://onsemi.com 3 ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage (Note 3) (VGS = 0 Vdc, ID = 250 mAdc) Temperature Coefficient (Positive) V(BR)DSS 60 − 67 67.2 − − Vdc mV/ °C Zero Gate Voltage Drain Current (VDS = 60 Vdc, VGS = 0 Vdc) (VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150°C) IDSS − − − − 1.0 10 mAdc Gate−Body Leakage Current (VGS = ± 15 Vdc, VDS = 0 Vdc) IGSS − − ±100 nAdc ON CHARACTERISTICS (Note 4) Gate Threshold Voltage (Note 4) (VDS = VGS, ID = 250 mAdc) Threshold Temperature Coefficient (Negative) VGS(th) 1.0 − 1.8 4.7 2.0 − Vdc mV/ °C Static Drain−to−Source On−Resistance (Note 4) (VGS = 5.0 Vdc, ID = 22.5 Adc) RDS(on) − 23 28 m W Static Drain−to−Source On−Voltage (Note 4) (VGS = 5.0 Vdc, ID = 45 Adc) (VGS = 5.0 Vdc, ID = 22.5 Adc, TJ = 150°C) VDS(on) − − 1.03 0.93 1.51 − Vdc Forward Transconductance (Note 4) (VDS = 8.0 Vdc, ID = 12 Adc) gFS − 22.8 − mhos DYNAMIC CHARACTERISTICS Input Capacitance (V 25 Vd V 0Vd Ciss − 1212 1700 pF Output Capacitance (VDS = 25 Vdc, VGS = 0 Vdc, f = 1.0 MHz) Coss − 352 480 Transfer Capacitance f = 1.0 MHz) Crss − 90 180 SWITCHING CHARACTERISTICS (Note 5) Turn−On Delay Time td(on) − 13 30 ns Rise Time (VDD = 30 Vdc, ID = 45 Adc, tr − 341 680 Turn−Off Delay Time (VDD 30 Vdc, ID 45 Adc, VGS = 5.0 Vdc, RG = 9.1 W) (Note 4) td(off) − 36 75 Fall Time tf − 158 320 Gate Charge (V 48 Vd I 45 Ad QT − 23 32 nC (VDS = 48 Vdc, ID = 45 Adc, VGS = 5.0 Vdc) (Note 4) Q1 − 4.6 − VGS = 5.0 Vdc) (Note 4) Q2 − 14.1 − SOURCE−DRAIN DIODE CHARACTERISTICS Forward On−Voltage (IS = 45 Adc, VGS = 0 Vdc) (Note 4) (IS = 45 Adc, VGS = 0 Vdc, TJ = 150°C) VSD − − 1.01 0.92 1.15 − Vdc Reverse Recovery Time (I 45 Ad V 0Vd trr − 56 − ns (IS = 45 Adc, VGS = 0 Vdc, dIS/dt = 100 A/ms) (Note 4) ta − 30 − dIS/dt = 100 A/ms) (Note 4) tb − 26 − Reverse Recovery Stored Charge QRR − 0.09 − mC 3. When surface mounted to an FR4 board using the minimum recommended pad size, (Cu Area 0.412 in2). 4. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%. 5. Switching characteristics are independent of operating junction temperatures. |
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