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SSTVF16859EC Datasheet(PDF) 2 Page - NXP Semiconductors

Part # SSTVF16859EC
Description  13-bit 1:2 SSTL_2 registered buffer for DDR
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

SSTVF16859EC Datasheet(HTML) 2 Page - NXP Semiconductors

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Philips Semiconductors
Product data sheet
SSTVF16859
13-bit 1:2 SSTL_2 registered buffer for DDR
2
2004 Jul 12
FEATURES
Stub-series terminated logic for 2.5 V V
DD (SSTL_2)
Designed for PC1600–PC2700 (at 2.5 V) and PC3200 (at 2.6 V)
applications
Pin and function compatible with JEDEC standard SSTV16859
Supports SSTL_2 signal inputs as per JESD 8–9
Flow-through architecture optimizes PCB layout
ESD classification testing is done to JEDEC Standard JESD22.
Protection exceeds 2000 V to HBM per method A114.
Latch-up testing is done to JEDEC Standard JESD78, which
exceeds 100 mA.
Supports efficient low power standby operation
Full DDR solution when used with PCKVF857
Available in 64-pin TSSOP, 96-ball LFBGA and 56-terminal
HVQFN packages
DESCRIPTION
The SSTVF16859 is a 13-bit to 26-bit SSTL_2 registered driver with
differential clock inputs, designed to operate between 2.3 V and
2.7 V for PC1600 – PC2700 applications or between 2.5 V and 2.7 V
for PC3200 applications. All inputs are compatible with the JEDEC
standard for SSTL_2 with VREF normally at 0.5*VDD, except the
LVCMOS reset (RESET) input. All outputs are SSTL_2, Class II
compatible which can be used for standard stub-series applications
or capacitive loads. Master reset (RESET) asynchronously resets all
registers to zero.
The SSTVF16859 is intended to be incorporated into standard
DIMM (Dual In-Line Memory Module) designs defined by JEDEC,
such as DDR (Double Data Rate) SDRAM and SDRAM II Memory
Modules. Different from traditional SDRAM, DDR SDRAM transfers
data on both clock edges (rising and falling), thus doubling the peak
bus bandwidth. A DDR DRAM rated at 133 MHz will have a burst
rate of 266 MHz.
The device data inputs consist of different receivers. One differential
input is tied to the input pin while the other is tied to a reference
input pad, which is shared by all inputs.
The clock input is fully differential (CK and CK) to be compatible with
DRAM devices that are installed on the DIMM. Data are registered
at the crossing of CK going HIGH, and CK going LOW. However,
since the control inputs to the SDRAM change at only half the data
rate, the device must only change state on the positive transition of
the CK signal. In order to be able to provide defined outputs from the
device even before a stable clock has been supplied, the device has
an asynchronous input pin (RESET), which when held to the LOW
state, resets all registers and all outputs to the LOW state.
The device supports low-power standby operation. When RESET is
LOW, the differential input receivers are disabled, and undriven
(floating) data, clock, and reference voltage (VREF) inputs are
allowed. In addition, when RESET is LOW, all registers are reset,
and all outputs are forced LOW. The LVCMOS RESET input must
always be held at a valid logic HIGH or LOW level.
To ensure defined outputs from the register before a stable clock
has been supplied, RESET must be held in the LOW state during
power-up.
In the DDR DIMM application, RESET is specified to be completely
asynchronous with respect to CK and CK. Therefore, no timing
relationship can be guaranteed between the two. When entering
RESET, the register will be cleared and the outputs will be driven
LOW. As long as the data inputs are LOW, and the clock is stable
during the time from the LOW-to-HIGH transition of RESET until the
input receivers are fully enabled, the outputs will remain LOW.
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C; tr = tf ≤ 2.5 ns
SYMBOL
PARAMETER
CONDITIONS
TYPICAL
UNIT
tPHL/tPLH
Propagation delay; CLK to Qn
CL = 30 pF; VDD = 2.5 V
1.7
ns
CI
Input capacitance
VCC = 2.5 V
2.8
pF
NOTE:
1. CPD is used to determine the dynamic power dissipation (PD in µW) PD = CPD × VCC2 × fi + Σ (CL × VCC2 × fo) where:
fi = input frequency in MHz; CL = output load capacity in pF; fo = output frequency in MHz; VCC = supply voltage in V;
Σ (CL × VCC2 × fo) = sum of the outputs.
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
ORDER CODE
DWG NUMBER
56-Terminal Plastic HVQFN
0
°C to +70 °C
SSTVF16859BS
SOT684-1
64-Pin Plastic TSSOP
0
°C to +70 °C
SSTVF16859DGG
SOT646-1
96-Ball Plastic LFBGA
0
°C to +70 °C
SSTVF16859EC
SOT536-1


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