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AM26C31C Datasheet(PDF) 11 Page - Texas Instruments |
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AM26C31C Datasheet(HTML) 11 Page - Texas Instruments |
11 / 21 page PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) 5962-9163901Q2A ACTIVE LCCC FK 20 1 None POST-PLATE Level-NC-NC-NC 5962-9163901QEA ACTIVE CDIP J 16 1 None A42 SNPB Level-NC-NC-NC 5962-9163901QFA ACTIVE CFP W 16 1 None A42 SNPB Level-NC-NC-NC AM26C31CD ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR AM26C31CDBLE OBSOLETE SSOP DB 16 None Call TI Call TI AM26C31CDBR ACTIVE SSOP DB 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM AM26C31CDR ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR AM26C31CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC AM26C31CNSR ACTIVE SO NS 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM AM26C31ID ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR AM26C31IDBLE OBSOLETE SSOP DB 16 None Call TI Call TI AM26C31IDBR ACTIVE SSOP DB 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM AM26C31IDR ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR AM26C31IN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC AM26C31INSR ACTIVE SO NS 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM AM26C31IPW ACTIVE TSSOP PW 16 90 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM AM26C31MFKB ACTIVE LCCC FK 20 1 None POST-PLATE Level-NC-NC-NC AM26C31MJB ACTIVE CDIP J 16 1 None A42 SNPB Level-NC-NC-NC AM26C31MWB ACTIVE CFP W 16 1 None A42 SNPB Level-NC-NC-NC AM26C31QD ACTIVE SOIC D 16 40 None CU NIPDAU Level-1-220C-UNLIM AM26C31QDR ACTIVE SOIC D 16 2500 None CU NIPDAU Level-1-220C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. PACKAGE OPTION ADDENDUM www.ti.com 11-Feb-2005 Addendum-Page 1 |
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