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ISO721 Datasheet(PDF) 11 Page - Texas Instruments |
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ISO721 Datasheet(HTML) 11 Page - Texas Instruments |
11 / 22 page www.ti.com DEVICE INFORMATION DEVICE I/O SCHEMATIC 13 W 8 W VCC2 EN 1 MW Enable VCC2 500 W VCC2 Output OUT IN 1 MW Input VCC1 VCC1 500 W VCC1 ISO721, ISO721M ISO722, ISO722M SLLS629B – JANUARY 2006 – REVISED MAY 2006 PACKAGE CHARACTERISTICS PARAMETER TEST CONDITIONS MIN TYP MAX UNIT L(101) Minimum air gap (Clearance) (1) Shortest terminal to terminal distance through air 4.8 mm Shortest terminal to terminal distance across the L(102) Minimum external tracking (Creepage) 4.3 mm package surface Tracking resistance (comparative tracking CTI DIN IEC 60112/VDE 0303 Part 1 ≥ 175 V index) Minimum internal gap (internal clearance) Distance through insulation 0.008 mm Input to output, VIO = 500 V, all pins on each side RIO Isolation resistance of the barrier tied together creating a two-terminal >1012 Ω device Barrier capacitance CIO VI = 0.4 sin (4E6πt) 1 pF Input-to-output CI Input capacitance to ground VI = 0.4 sin (4E6πt) 1 pF (1) Creepage and clearance requirements are applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed circuit board do not reduce this distance. Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications. IEC 60664-1 RATINGS TABLE PARAMETER TEST CONDITIONS SPECIFICATION Basic isolation group Material group IIIa Rated mains voltage ≤150 VRMS I-IV Installation classification Rated mains voltage ≤300 VRMS I-III Equivalent Input and Output Schematic Diagrams 11 Submit Documentation Feedback |
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